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DS3487N

Texas Instruments

DS3487N by Texas Instruments

DS3487N by Texas Instruments is a 4-function LINE DRIVER with 15ns max transmit delay and 5V power supply. Ideal for EIA-422 interface standard applications, it offers complementary output polarity and differential output for commercial temperature grade operations.

Median Price

$0.808

Lifecycle Status

Suppliers In-Stock

53

In-Stock Inventory

1k+

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DigiKey

USA . 8,016 parts In-Stock

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Verical

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Rochester

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Component Electronics Inc.

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Digital Electronic Gebert Verwaltungs UG

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Semicontronic

India . 7,633 parts In-Stock

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$0.560

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$0.546

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$0.543

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Ampacity Inc.

Singapore . 7,528 parts In-Stock

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$0.560

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Corphita

USA . 1,527 parts In-Stock

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Parana Technologies

USA . 1,316 parts In-Stock

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$12.106

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DigiPath Technology Company

USA . 1,536 parts In-Stock

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$11.868

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ChromeModa Solutions

Germany . 3,914 parts In-Stock

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IDEA Electronic Components Group

UK . 134 parts In-Stock

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Continental Prestige Electronics

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Alle Elektronik GmbH

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Overview

Discover the DS3487N by Texas Instruments, a top-of-the-line line driver and receiver that boasts unparalleled quality and performance. With four functions packed into one compact package, this product is perfect for a wide range of applications. From industrial automation to telecommunications, the DS3487N delivers reliable and efficient signal transmission. Trust in Texas Instruments, a renowned manufacturer known for their innovative technology and commitment to excellence. Experience the value and benefits this product offers, from its fast transmit delay to its high-level input current. Upgrade your systems with the DS3487N and unlock a new level of precision and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside the package, ensuring a longer lifespan for the product.

Maximum Transmit Delay: 15 ns

The low transmit delay helps in fast data transmission, making this product suitable for applications that require quick response times.

Output Characteristics: 3-STATE

The 3-STATE output allows for high flexibility in controlling the signals, making it compatible with a variety of systems and configurations.

Differential Output: YES

Differential outputs help in reducing noise and interference in signal transmission, ensuring high signal integrity and reliable communication.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and robust operation, making this product ideal for applications that require efficient data processing.

Nominal Supply Voltage: 5 V

Operating at a standard 5 V supply voltage makes this product compatible with a wide range of systems and ensures easy integration into existing setups.

Technical Specifications

Line Drivers & Receivers DS3487N attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Differential Output:

YES

Driver No. of Bits:

4

Maximum High Level Input Current:

.00005 Amp

Input Characteristics:

STANDARD

Interface IC Type:

Interface Standard:

EIA-422

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.304 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Minimum Out Swing:

2 V

Output Characteristics:

3-STATE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Receive Delay:

0 ns

Maximum Seated Height:

5.08 mm

Sub-Category:

Line Driver or Receivers

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

15 ns

Width:

7.62 mm

Trade Compliance

DS3487N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-287-0086, 5962012870086, 5962-99-722-6068, 5962997226068

NIIN

012870086, 997226068

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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