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DS34LV86TM

Texas Instruments

DS34LV86TM by Texas Instruments

DS34LV86TM by Texas Instruments is a 16-terminal line receiver with CMOS technology. It operates at 3.3V, has 4 functions, and supports EIA-422-B interface standard. With a small outline package style, it's ideal for industrial applications requiring differential Schmitt trigger input characteristics.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Nova Conductors

Japan . 500 parts In-Stock

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Component Electronics Inc.

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Digiode

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ComSIT Distribution GmbH

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Beltway Electronics Company

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Zilex Electronics Inc.

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Martec Srl

Italy . 109 parts In-Stock

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LIBRA Elektronik GmbH

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North Shore Components

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Inland Empire Components Inc.

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Speed Components Ltd

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

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ECAB

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Odintec Ltd.

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R&J Components

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Sunrise Surplus Inc.

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Prism Electronics

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Mil-Aero Solutions, Inc.

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LWI Electronics Inc

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PC Components Company LLC

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Continental Prestige Electronics

USA . 2,551 parts In-Stock

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$1.870

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$1.833

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Argo Parts USA

USA . 27 parts In-Stock

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Semicontronic

India . 282 parts In-Stock

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Parana Technologies

USA . 1,277 parts In-Stock

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$4.047

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$4.510

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DigiPath Technology Company

USA . 1,588 parts In-Stock

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IDEA Electronic Components Group

UK . 1,674 parts In-Stock

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ChromeModa Solutions

Germany . 134 parts In-Stock

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AZTECH Wire

Italy . 210 parts In-Stock

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Corohmni

South Africa . 343 parts In-Stock

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One Stop Electronics

USA . 1,138 parts In-Stock

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Metaverse IC Inc.

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Authorized Procurement Solutions

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Kepictronics

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Perfect Parts

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Alle Elektronik GmbH

Germany . 1,178 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Microchip USA

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Speed Components Ltd (Excess)

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Overview

Upgrade your communication systems with the Texas Instruments DS34LV86TM Line Driver & Receiver. Known for their high-quality products, TI offers a reliable solution that ensures seamless data transmission in various industrial applications. With a compact design and low power consumption, this product provides exceptional value to customers by improving signal integrity and reducing interference. Trust Texas Instruments to deliver top-notch performance and unmatched reliability for all your communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the line driver & receiver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient integration onto circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for different application requirements.

No. of Functions: 4

Multiple functions in a single package offer cost-effectiveness and efficiency in circuit design.

Power Supplies (V): 3.3

Operates on a standard power supply voltage, compatible with many systems and devices.

No. of Terminals: 16

Sufficient terminals for interfacing with other components or systems, facilitating communication and data transfer.

Minimum Supply Voltage: 3 V

Works on a low supply voltage, suitable for energy-efficient applications and battery-powered devices.

Maximum Operating Temperature: 85 °C

Capable of withstanding high operating temperatures, ensuring stability and performance in demanding environments.

Minimum Operating Temperature: -40 °C

Operates effectively in extreme cold conditions, making it suitable for diverse applications and environments.

Terminal Finish: TIN LEAD

Provides reliable electrical connections and solderability, ensuring secure terminal connections.

Width: 3.9 mm

Compact width for space-saving installation and integration in tight layouts or designs.

Maximum Output Low Current: 6 Amp

Capable of providing a high output current, allowing for driving power-hungry loads or long transmission lines.

Receiver No. of Bits: 4

Enables accurate reception and processing of digital signals with a high level of precision and resolution.

Technology: CMOS

Uses CMOS technology for low power consumption and high noise immunity, ensuring reliable operation in various environments.

Interface Standard: EIA-422-B; TIA-422-B; V.11

Compliance with industry standards for communication interfaces ensures compatibility and interoperability with different systems.

Technical Specifications

Line Drivers & Receivers DS34LV86TM attributes and parameters. Explore more Line Drivers & Receivers devices from Texas Instruments

Specs

Input Characteristics:

DIFFERENTIAL SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

EIA-422-B; TIA-422-B; V.11

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Low Current:

6 Amp

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Receive Delay:

35 ns

Receiver No. of Bits:

4

Maximum Seated Height:

1.75 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

20

Width:

3.9 mm

Trade Compliance

DS34LV86TM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-607-1740, 5962016071740

NIIN

016071740

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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