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DS16EV5110ASQ

Texas Instruments

DS16EV5110ASQ by Texas Instruments

DS16EV5110ASQ by Texas Instruments is a 48-terminal CONSUMER CIRCUIT IC with SQUARE package style. Operating b/w -40 to 85 °C, it has a supply voltage range of 3-3.6 V. Ideal for industrial applications requiring compact design and high performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,818 parts In-Stock

1+ parts

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3,818

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Digiode

USA . 3,251 parts In-Stock

1+ parts

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3,251

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Anansix

USA . 1,714 parts In-Stock

1+ parts

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1,714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 590 parts In-Stock

1+ parts

$0.154

100+ parts

-

1k+ parts

-

10k+ parts

$0.148

590

$0.154

-

-

$0.148

Northwest PG Solutions

USA . 395 parts In-Stock

1+ parts

$0.169

100+ parts

-

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-

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$0.149

395

$0.169

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-

$0.149

Parana Technologies

USA . 1,978 parts In-Stock

1+ parts

$1.396

100+ parts

-

1k+ parts

$2.104

10k+ parts

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1,978

$1.396

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$2.104

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DigiPath Technology Company

USA . 122 parts In-Stock

1+ parts

$1.537

100+ parts

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122

$1.537

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ChromeModa Solutions

Germany . 3,138 parts In-Stock

1+ parts

$1.568

100+ parts

$1.286

1k+ parts

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10k+ parts

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3,138

$1.568

$1.286

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IDEA Electronic Components Group

UK . 577 parts In-Stock

1+ parts

$1.568

100+ parts

-

1k+ parts

$1.411

10k+ parts

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577

$1.568

-

$1.411

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$14.376

100+ parts

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326

$14.376

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One Stop Electronics

USA . 831 parts In-Stock

1+ parts

$19.800

100+ parts

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831

$19.800

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A-Z Elektronik GmbH

Germany . 4,721 parts In-Stock

1+ parts

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4,721

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Alle Elektronik GmbH

Germany . 3,147 parts In-Stock

1+ parts

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3,147

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Corphita

USA . 2,397 parts In-Stock

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2,397

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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2,000

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Overview

Enhance your consumer electronics with the DS16EV5110ASQ by Texas Instruments. With a reputation for top-quality manufacturing, Texas Instruments delivers a cutting-edge product that excels in various applications within the consumer IC category. This surface-mount square package offers incredible value with its heat sink/slug and very thin profile design, providing customers with superior performance and reliability. Elevate your products to new heights with the DS16EV5110ASQ and experience the advantages of Texas Instruments' trusted technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and cost-effective PCB assembly, making this product suitable for mass production.

Package Shape: SQUARE

Square package shape helps in optimizing space on the PCB board, making it ideal for applications where board real estate is limited.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications, ensuring compatibility and efficiency in consumer electronic devices.

No. of Terminals: 48

A higher number of terminals allow for more connections and functionalities, making this product versatile and suitable for complex circuits.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, enhancing its reliability and durability in various environments.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures enables this product to function in extreme cold conditions, making it suitable for a variety of applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhances thermal management and overall performance of the product.

Maximum Seated Height: 0.8 mm

Low seated height helps in reducing the overall profile of the PCB assembly, making it suitable for compact electronic devices and solutions.

Width: 7 mm

Compact width contributes to space-saving on the PCB board, allowing for more components or features to be included in a limited space.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement enables operation in low-power settings, making it energy-efficient and suitable for battery-operated devices.

Length: 7 mm

Short length helps in optimizing board space and layout, making it suitable for applications where size constraints are critical.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable performance in harsh industrial environments, making this product suitable for industrial applications.

Terminal Form: NO LEAD

No-lead terminal form eliminates the risk of lead contamination and enhances the product's environmental friendliness and compliance with regulations.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB board, allowing for compact design and efficient use of board space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate moisture sensitivity, suitable for handling and storage in standard manufacturing environments.

Maximum Supply Voltage (Vsup): 3.6 V

Moderate maximum supply voltage allows for flexibility in power input options, making this product compatible with various power sources.

Technical Specifications

Other Function Consumer ICs DS16EV5110ASQ attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS16EV5110ASQ General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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