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DS16EV5110ASQX

Texas Instruments

DS16EV5110ASQX by Texas Instruments

DS16EV5110ASQX by Texas Instruments is a 48-terminal CONSUMER CIRCUIT IC with SQUARE package. Operating from -40 to 85 °C, it has a supply voltage range of 3-3.6 V. Ideal for industrial applications requiring high-speed signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,576 parts In-Stock

1+ parts

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6,576

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Anansix

USA . 2,650 parts In-Stock

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2,650

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Digiode

USA . 938 parts In-Stock

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938

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 456 parts In-Stock

1+ parts

$2.522

100+ parts

-

1k+ parts

$3.012

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456

$2.522

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$3.012

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IDEA Electronic Components Group

UK . 2,260 parts In-Stock

1+ parts

$2.834

100+ parts

-

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$2.551

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2,260

$2.834

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$2.551

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ChromeModa Solutions

Germany . 1,021 parts In-Stock

1+ parts

$2.834

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$2.324

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1,021

$2.834

$2.324

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One Stop Electronics

USA . 1,358 parts In-Stock

1+ parts

$5.800

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1,358

$5.800

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AZTECH Wire

Italy . 493 parts In-Stock

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$13.839

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493

$13.839

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Lixinc

USA . 6,240 parts In-Stock

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6,240

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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DigiPath Technology Company

USA . 2,336 parts In-Stock

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$2.555

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2,336

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$2.555

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Corphita

USA . 926 parts In-Stock

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926

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Northwest PG Solutions

USA . 902 parts In-Stock

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$4.466

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902

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$4.466

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Native Components

USA . 467 parts In-Stock

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$4.420

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467

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$4.420

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Overview

Enhance your consumer electronics with the DS16EV5110ASQX by Texas Instruments. Known for their high-quality products, Texas Instruments delivers exceptional performance and reliability in every component they create. This square-shaped consumer circuit is perfect for a wide range of applications, offering customers value and benefits like improved functionality and seamless integration. Upgrade your devices today with the DS16EV5110ASQX and experience the advantages of Texas Instruments technology.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly processes.

Package Shape: SQUARE

Square package shape provides a compact design, making it suitable for applications where space is limited.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer electronic applications, ensuring compatibility and optimal performance in various consumer devices.

No. of Terminals: 48

Ample number of terminals allow for versatile connectivity options and functionality within the circuit.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

Wide temperature range enables operation in both extreme cold and hot conditions, enhancing the product's versatility.

Terminal Position: QUAD

Quad terminal position facilitates efficient soldering and connection to the circuit board, ensuring stable electrical contact.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes the product suitable for low-power applications, conserving energy.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures durability and reliability in demanding industrial environments.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent any performance issues.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage tolerance provides a wide operating range and flexibility in different voltage input scenarios.

Technical Specifications

Other Function Consumer ICs DS16EV5110ASQX attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XQCC-N48

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

DS16EV5110ASQX General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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