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DRV592GQE

Texas Instruments

DRV592GQE by Texas Instruments

Texas Instruments DRV592GQE is a peripheral driver with 3A output current, suitable for industrial applications. It operates b/w -40 to 85°C, with built-in protections against overcurrent and thermal issues. The package style is grid array, very thin profile, fine pitch, making it ideal for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,575

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-

-

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Digiode

USA . 4,946 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,946

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-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 769 parts In-Stock

1+ parts

$2.717

100+ parts

-

1k+ parts

-

10k+ parts

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769

$2.717

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-

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Parana Technologies

USA . 1,493 parts In-Stock

1+ parts

$5.585

100+ parts

-

1k+ parts

$6.375

10k+ parts

-

1,493

$5.585

-

$6.375

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ChromeModa Solutions

Germany . 676 parts In-Stock

1+ parts

$6.275

100+ parts

$5.146

1k+ parts

-

10k+ parts

-

676

$6.275

$5.146

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-

IDEA Electronic Components Group

UK . 463 parts In-Stock

1+ parts

$6.275

100+ parts

-

1k+ parts

$5.648

10k+ parts

-

463

$6.275

-

$5.648

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AZTECH Wire

Italy . 442 parts In-Stock

1+ parts

$8.517

100+ parts

-

1k+ parts

-

10k+ parts

-

442

$8.517

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-

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One Stop Electronics

USA . 1,343 parts In-Stock

1+ parts

$31.500

100+ parts

-

1k+ parts

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10k+ parts

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1,343

$31.500

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-

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Corphita

USA . 4,361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,361

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DigiPath Technology Company

USA . 731 parts In-Stock

1+ parts

-

100+ parts

$5.658

1k+ parts

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10k+ parts

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731

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$5.658

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Native Components

USA . 591 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$2.396

10k+ parts

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591

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$2.396

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Overview

Enhance your electronic designs with the DRV592GQE by Texas Instruments, a top-quality peripheral driver that offers exceptional performance and reliability. Manufactured by the industry leader in semiconductor technology, this product is perfect for a wide range of applications, providing over current and thermal protections for added safety. With a maximum output current of 3 A and a compact square package shape, this driver delivers impressive power in a small footprint. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations and elevates your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, making it a good choice for long-lasting use.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, making the product suitable for compact designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage capability of 5.5V ensures compatibility with a wide range of power sources, increasing versatility.

Built-in Protections: OVER CURRENT; THERMAL

The built-in protections against over current and thermal issues enhance the product's safety and reliability, making it a secure choice for use.

No. of Terminals: 80

The 80 terminals provide ample connection points for various components, allowing for versatile integration into different systems.

Maximum Output Current: 3 A

With a maximum output current of 3A, this peripheral driver can efficiently handle power requirements, making it suitable for driving a variety of components.

Technical Specifications

Peripheral Drivers DRV592GQE attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

1

JESD-30 Code:

S-PBGA-B80

Length:

5 mm

No. of Functions:

1

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Maximum Output Current:

3 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA80,9X9,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

5 mm

Trade Compliance

DRV592GQE Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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