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DRV591VFPRG4

Texas Instruments

DRV591VFPRG4 by Texas Instruments

DRV591VFPRG4 by Texas Instruments is a peripheral driver with 2 functions, operating at 3/5V. It offers built-in protections against over current, thermal issues, and under voltage. With a package style of flatpack and low profile, it is ideal for industrial applications requiring differential input characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 17,300 parts In-Stock

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Vyrian

USA . 6,678 parts In-Stock

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Digiode

USA . 231 parts In-Stock

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Parana Technologies

USA . 55 parts In-Stock

1+ parts

$10.426

100+ parts

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$10.940

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55

$10.426

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$10.940

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Native Components

USA . 878 parts In-Stock

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$10.555

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878

$10.555

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Corohmni

South Africa . 387 parts In-Stock

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$10.762

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387

$10.762

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DigiPath Technology Company

USA . 2,280 parts In-Stock

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$11.481

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$10.562

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$11.481

$10.562

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Northwest PG Solutions

USA . 2,218 parts In-Stock

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$11.611

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$10.449

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2,218

$11.611

$10.449

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ChromeModa Solutions

Germany . 3,139 parts In-Stock

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$11.715

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$9.606

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$11.715

$9.606

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

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$11.715

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$11.129

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$10.544

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$11.715

$11.129

$10.544

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$12.178

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$11.082

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$9.986

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$12.178

$11.082

$9.986

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AZTECH Wire

Italy . 268 parts In-Stock

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$18.636

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One Stop Electronics

USA . 1,543 parts In-Stock

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$31.500

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Microchip USA

USA . 1,518 parts In-Stock

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Corphita

USA . 768 parts In-Stock

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Kepictronics

USA . 220 parts In-Stock

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Overview

Enhance your electronic projects with the high-quality DRV591VFPRG4 from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch peripheral drivers like this one that offer reliable performance and built-in protections against over current, thermal issues, and under voltage. With its compact square package body and impressive 32 terminals, this versatile component is perfect for a wide range of applications. Trust Texas Instruments to provide you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Ease of installation and space-saving design make this product convenient and suitable for compact applications.

Built-in Protections: OVER CURRENT; THERMAL; UNDER VOLTAGE

These protections help prevent damage to the device and connected peripherals, enhancing overall system reliability and safety.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding industrial environments without compromising performance.

Nominal Supply Voltage: 3.3 V

Stable supply voltage ensures consistent and reliable performance, making this product ideal for precision applications.

Technical Specifications

Peripheral Drivers DRV591VFPRG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Built-in Protections:

OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

1

Input Characteristics:

DIFFERENTIAL

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

2

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

DRV591VFPRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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