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DRV590DWPRG4

Texas Instruments

DRV590DWPRG4 by Texas Instruments

Texas Instruments' DRV590DWPRG4 is a Peripheral Driver with 20 terminals, operating at -40 to 85°C. It has dual terminal positions and uses CMOS technology. Ideal for industrial applications requiring power supplies of 3/5V in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,599 parts In-Stock

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6,599

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Digiode

USA . 3,006 parts In-Stock

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3,006

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Distributors (Availability)

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AZTECH Wire

Italy . 343 parts In-Stock

1+ parts

$6.900

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343

$6.900

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Parana Technologies

USA . 1,407 parts In-Stock

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$10.784

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$11.267

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1,407

$10.784

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$11.267

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DigiPath Technology Company

USA . 924 parts In-Stock

1+ parts

$11.875

100+ parts

$10.925

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924

$11.875

$10.925

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ChromeModa Solutions

Germany . 2,422 parts In-Stock

1+ parts

$12.117

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$9.936

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2,422

$12.117

$9.936

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IDEA Electronic Components Group

UK . 1,892 parts In-Stock

1+ parts

$12.117

100+ parts

$11.511

1k+ parts

$10.905

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1,892

$12.117

$11.511

$10.905

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One Stop Electronics

USA . 1,192 parts In-Stock

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$24.500

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1,192

$24.500

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Corphita

USA . 2,830 parts In-Stock

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2,830

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Northwest PG Solutions

USA . 826 parts In-Stock

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826

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Native Components

USA . 208 parts In-Stock

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Overview

Unlock the power of precision and reliability with Texas Instruments' DRV590DWPRG4 Peripheral Driver. Designed to meet industrial-grade standards, this small outline driver offers unparalleled performance for a wide range of applications. With its advanced CMOS technology and dual terminal position, this driver delivers seamless power management for your projects. Trust in Texas Instruments' reputation for quality and innovation, and experience the value and benefits that the DRV590DWPRG4 brings to your designs. Elevate your projects to the next level with this high-quality solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the peripheral driver, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3/5

The dual power supply options of 3V and 5V provide flexibility in voltage requirements for different applications.

No. of Terminals: 20

Having 20 terminals offers ample connectivity options for various peripherals, enabling comprehensive control and communication.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance in challenging industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the peripheral driver to function effectively even in extreme cold conditions.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that the peripheral driver is designed to withstand harsh industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the peripheral driver energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form provides secure solder connections, ensuring stable electrical connections and overall product durability.

Terminal Pitch: 1.27 mm

The tight terminal pitch of 1.27mm enables high-density mounting of components on the circuit board, maximizing space efficiency.

Technical Specifications

Peripheral Drivers DRV590DWPRG4 attributes and parameters. Explore more Peripheral Drivers devices from Texas Instruments

Specs

Driver No. of Bits:

1

JESD-30 Code:

R-PDSO-G20

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

DRV590DWPRG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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