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DMF2802PZA-60

Texas Instruments

DMF2802PZA-60 by Texas Instruments

Texas Instruments' DMF2802PZA-60 is a 32-bit DSP with 3072 RAM words, operating at up to 100 MHz. It features low power mode, boundary scan, and internal bus architecture for industrial applications requiring high-speed digital signal processing in a compact flatpack package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,426 parts In-Stock

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Digiode

USA . 3,020 parts In-Stock

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3,020

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Distributors (Availability)

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Native Components

USA . 566 parts In-Stock

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$0.070

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$0.067

566

$0.070

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$0.067

Northwest PG Solutions

USA . 600 parts In-Stock

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$0.077

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-

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$0.068

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$0.077

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$0.068

AZTECH Wire

Italy . 565 parts In-Stock

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$14.514

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$14.514

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One Stop Electronics

USA . 397 parts In-Stock

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$27.000

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397

$27.000

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Corohmni

South Africa . 4,927 parts In-Stock

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$35.763

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$35.763

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Parana Technologies

USA . 534 parts In-Stock

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$49.873

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534

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ChromeModa Solutions

Germany . 6,289 parts In-Stock

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$56.037

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$45.950

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

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$56.037

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$53.235

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$50.433

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Corphita

USA . 1,033 parts In-Stock

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DigiPath Technology Company

USA . 953 parts In-Stock

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$50.523

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Microchip USA

USA . 124 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DMF2802PZA-60 by Texas Instruments. Crafted with precision and expertise, this Digital Signal Processor (DSP) offers unparalleled performance and reliability for a wide range of applications. From high-speed data processing to efficient energy management, this innovative product delivers exceptional value and benefits to customers seeking top-notch quality and seamless functionality. Experience the advantages of Texas Instruments' state-of-the-art technology with the DMF2802PZA-60 and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Maximum Supply Voltage: 1.89 V

Allows for a higher supply voltage, which can improve performance and efficiency of the DSP.

Minimum Operating Temperature: -40 °C

Ability to operate in low temperature environments makes it suitable for a wide range of applications and industries.

RAM Words: 3072

Ample amount of RAM allows for efficient processing and storage of data, enhancing the overall performance of the DSP.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast processing speeds, making the DSP ideal for real-time signal processing applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type allows for seamless integration with other digital signal processing components, expanding the capabilities of the product.

Low Power Mode: YES

The low power mode feature helps in conserving energy and prolonging battery life, making it an energy-efficient choice for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) DMF2802PZA-60 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

3072

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

DMF2802PZA-60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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