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DLP5533AAFYSQ1

Texas Instruments

DLP5533AAFYSQ1 by Texas Instruments

DLP5533AAFYSQ1 by Texas Instruments is a consumer IC with 149 terminals in a rectangular package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.7V to 1.95V. This industrial-grade IC is ideal for applications requiring high precision and reliability in various electronic devices.

Median Price

$171.410

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 330 parts In-Stock

1+ parts

$171.410

100+ parts

$139.195

1k+ parts

-

10k+ parts

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330

$171.410

$139.195

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,106 parts In-Stock

1+ parts

-

100+ parts

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7,106

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Digiode

USA . 2,919 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,919

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,467 parts In-Stock

1+ parts

$0.599

100+ parts

-

1k+ parts

$1.678

10k+ parts

-

1,467

$0.599

-

$1.678

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ChromeModa Solutions

Germany . 6,728 parts In-Stock

1+ parts

$0.673

100+ parts

$0.552

1k+ parts

-

10k+ parts

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6,728

$0.673

$0.552

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IDEA Electronic Components Group

UK . 276 parts In-Stock

1+ parts

$0.673

100+ parts

-

1k+ parts

$0.606

10k+ parts

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276

$0.673

-

$0.606

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Native Components

USA . 548 parts In-Stock

1+ parts

$1.684

100+ parts

-

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548

$1.684

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Northwest PG Solutions

USA . 483 parts In-Stock

1+ parts

$1.853

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483

$1.853

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$8.326

100+ parts

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817

$8.326

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One Stop Electronics

USA . 1,551 parts In-Stock

1+ parts

$14.800

100+ parts

-

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1,551

$14.800

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Microchip USA

USA . 2,651 parts In-Stock

1+ parts

$143.640

100+ parts

$139.810

1k+ parts

$137.900

10k+ parts

$135.980

2,651

$143.640

$139.810

$137.900

$135.980

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10,000

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Corphita

USA . 3,811 parts In-Stock

1+ parts

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100+ parts

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3,811

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DigiPath Technology Company

USA . 910 parts In-Stock

1+ parts

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100+ parts

$0.607

1k+ parts

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10k+ parts

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910

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$0.607

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Overview

Enhance your consumer electronic designs with the DLP5533AAFYSQ1 by Texas Instruments, a top-tier manufacturer known for its high-quality products. This versatile IC offers a wide range of applications in various industries, providing unmatched reliability and performance. With its advanced features and innovative design, this product delivers exceptional value and benefits to customers looking for cutting-edge solutions. Trust Texas Instruments to bring you the best in consumer circuit technology, setting new standards in the industry.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material composition ensures excellent durability and heat resistance, making the product suitable for industrial environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space and easy integration into circuit boards.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, ensuring reliable performance and compatibility with various devices.

No. of Terminals: 149

With a high number of terminals, this IC offers increased connectivity options and versatility in circuit design.

Package Style (Meter): GRID ARRAY, SHRINK PITCH

The grid array and shrink pitch design enable dense packaging of components, saving space and enhancing overall system performance.

Maximum Operating Temperature: 105 °C

The high operating temperature range allows the product to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures the product can operate in extreme cold conditions without performance degradation.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easy soldering and connection to external devices.

Width: 22.3 mm

Compact width size allows for space-saving integration into various electronic devices.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage requirement makes the product energy-efficient and suitable for battery-powered applications.

Length: 32.2 mm

Moderate length size provides a balance between functionality and space efficiency in circuit design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in harsh environmental conditions.

Terminal Form: PIN/PEG

Pin/peg terminal form offers secure connection points for easy installation and maintenance of the product.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting of the IC on circuit boards, enabling compact designs.

Maximum Supply Voltage (Vsup): 1.95 V

The maximum supply voltage specification indicates the product's compatibility with various power sources.

Technical Specifications

Other Function Consumer ICs DLP5533AAFYSQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P149

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

22.3 mm

Trade Compliance

DLP5533AAFYSQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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