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DLP5530AFYKQ1

Texas Instruments

DLP5530AFYKQ1 by Texas Instruments

DLP5530AFYKQ1 by Texas Instruments is a consumer IC with 149 terminals in a grid array package. It operates b/w -40 to 105°C, suitable for industrial applications. With a terminal pitch of 1.27mm and compact dimensions of 32.2x22.3x5.4mm, it's ideal for various electronic devices requiring precise control and processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,011 parts In-Stock

1+ parts

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4,011

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Digiode

USA . 739 parts In-Stock

1+ parts

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739

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 429 parts In-Stock

1+ parts

$0.551

100+ parts

-

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429

$0.551

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Northwest PG Solutions

USA . 1,638 parts In-Stock

1+ parts

$0.606

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1,638

$0.606

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Parana Technologies

USA . 29 parts In-Stock

1+ parts

$1.826

100+ parts

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$2.377

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29

$1.826

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$2.377

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DigiPath Technology Company

USA . 1,838 parts In-Stock

1+ parts

$2.011

100+ parts

$1.850

1k+ parts

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1,838

$2.011

$1.850

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ChromeModa Solutions

Germany . 5,552 parts In-Stock

1+ parts

$2.052

100+ parts

$1.683

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5,552

$2.052

$1.683

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IDEA Electronic Components Group

UK . 2,207 parts In-Stock

1+ parts

$2.052

100+ parts

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$1.847

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2,207

$2.052

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$1.847

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One Stop Electronics

USA . 366 parts In-Stock

1+ parts

$7.800

100+ parts

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366

$7.800

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AZTECH Wire

Italy . 817 parts In-Stock

1+ parts

$10.821

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817

$10.821

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Microchip USA

USA . 2,640 parts In-Stock

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2,640

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Corphita

USA . 1,414 parts In-Stock

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1,414

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Overview

Elevate your consumer electronics with the DLP5530AFYKQ1 by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge solutions for various applications in the consumer ICs category. This highly advanced IC offers unmatched value, providing customers with top-notch performance and efficiency. Whether you're designing a new gaming console or enhancing a smart home device, the DLP5530AFYKQ1 will take your product to the next level. Trust Texas Instruments to elevate your technology to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making it suitable for long-term use.

Screening Level: AEC-Q100

The AEC-Q100 screening level indicates that this product is automotive-grade, meeting strict quality and reliability standards for use in automotive applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, this product can withstand extreme temperature conditions without malfunctioning.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C enables this product to function reliably even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable performance over time.

Width: 22.3 mm

With a compact width of 22.3 mm, this product can be easily integrated into various electronic devices without taking up too much space.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement of 1.7 V makes this product energy-efficient and suitable for low-power applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can operate reliably in industrial environments where temperature fluctuations are common.

Technical Specifications

Other Function Consumer ICs DLP5530AFYKQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P149

JESD-609 Code:

e4

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

5.4 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

22.3 mm

Trade Compliance

DLP5530AFYKQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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