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DLP5532AFYSQ1

Texas Instruments

DLP5532AFYSQ1 by Texas Instruments

DLP5532AFYSQ1 by Texas Instruments is a rectangular consumer IC with 149 terminals, operating temperature range of -40 to 105°C. It features a ceramic, metal-sealed cofired package body and is ideal for industrial applications requiring a supply voltage b/w 1.7V to 1.95V.

Median Price

$174.710

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$174.710

100+ parts

$140.520

1k+ parts

-

10k+ parts

-

31

$174.710

$140.520

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,311 parts In-Stock

1+ parts

$118.702

100+ parts

-

1k+ parts

-

10k+ parts

-

2,311

$118.702

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-

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Vyrian

USA . 7,113 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,113

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,163 parts In-Stock

1+ parts

$0.669

100+ parts

-

1k+ parts

$1.718

10k+ parts

-

1,163

$0.669

-

$1.718

-

DigiPath Technology Company

USA . 932 parts In-Stock

1+ parts

$0.737

100+ parts

$0.678

1k+ parts

-

10k+ parts

-

932

$0.737

$0.678

-

-

IDEA Electronic Components Group

UK . 1,193 parts In-Stock

1+ parts

$0.752

100+ parts

-

1k+ parts

$0.677

10k+ parts

-

1,193

$0.752

-

$0.677

-

ChromeModa Solutions

Germany . 60 parts In-Stock

1+ parts

$0.752

100+ parts

$0.617

1k+ parts

-

10k+ parts

-

60

$0.752

$0.617

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-

Corphita

USA . 1,773 parts In-Stock

1+ parts

$112.455

100+ parts

-

1k+ parts

-

10k+ parts

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1,773

$112.455

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QUARKTWIN TECHNOLOGY LTD

USA . 28,486 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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28,486

-

-

-

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Northwest PG Solutions

USA . 1,818 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.202

10k+ parts

-

1,818

-

-

$3.202

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Native Components

USA . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.169

10k+ parts

-

226

-

-

$3.169

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Overview

Experience the ultimate in quality and innovation with the DLP5532AFYSQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you cutting-edge technology and reliability you can trust. This versatile consumer IC offers endless possibilities, perfect for a variety of applications. From its durable package body material to its wide temperature range, this IC delivers unmatched performance. Discover the value and benefits that this product can bring to your projects. Upgrade your designs with the DLP5532AFYSQ1 today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material provides excellent durability and thermal conductivity, ensuring reliable performance in various operating conditions.

No. of Terminals: 149

The high number of terminals allows for versatile connectivity and integration with other components, enabling complex circuit designs and functionality.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand stressful thermal conditions without compromising its performance, making it suitable for industrial applications.

Terminal Position: PERPENDICULAR

The perpendicular terminal position makes it easier to insert and connect the IC in the circuit, simplifying the assembly process and reducing the risk of misalignment.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage requirement allows for efficient power consumption and compatibility with various power sources, making it energy-efficient and versatile in its applications.

Technical Specifications

Other Function Consumer ICs DLP5532AFYSQ1 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-CPGA-P149

Length:

32.2 mm

No. of Functions:

1

No. of Terminals:

149

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA149,16X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

4.665 mm

Maximum Supply Voltage (Vsup):

1.95 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

PERPENDICULAR

Width:

22.3 mm

Trade Compliance

DLP5532AFYSQ1 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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