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DIR1703E/2KG4

Texas Instruments

DIR1703E/2KG4 by Texas Instruments

DIR1703E/2KG4 by Texas Instruments is a consumer IC with 28 terminals in a small outline package. It operates b/w -25°C to 85°C, with a supply voltage range of 3V to 3.6V and max current of 40.7mA. Ideal for applications requiring precise signal processing in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 12,485 parts In-Stock

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12,485

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Zilex Electronics Inc.

Canada . 9,370 parts In-Stock

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9,370

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Digiode

USA . 3,125 parts In-Stock

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3,125

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Vyrian

USA . 2,867 parts In-Stock

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2,867

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 876 parts In-Stock

1+ parts

$1.460

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876

$1.460

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Parana Technologies

USA . 406 parts In-Stock

1+ parts

$1.561

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$2.205

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406

$1.561

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$2.205

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Northwest PG Solutions

USA . 2,161 parts In-Stock

1+ parts

$1.606

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2,161

$1.606

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DigiPath Technology Company

USA . 972 parts In-Stock

1+ parts

$1.719

100+ parts

$1.581

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972

$1.719

$1.581

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ChromeModa Solutions

Germany . 6,597 parts In-Stock

1+ parts

$1.754

100+ parts

$1.438

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6,597

$1.754

$1.438

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IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$1.754

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$1.579

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921

$1.754

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$1.579

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AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$10.651

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271

$10.651

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One Stop Electronics

USA . 307 parts In-Stock

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$18.800

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307

$18.800

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Corphita

USA . 3,656 parts In-Stock

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3,656

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock the potential of your consumer electronics with the DIR1703E/2KG4 from Texas Instruments. This high-quality IC offers unparalleled performance and reliability, thanks to the renowned reputation of its manufacturer. Ideal for a wide range of applications, this versatile device delivers value and benefits that exceed expectations. Experience the advantages of seamless integration, efficient operation, and enhanced functionality with the DIR1703E/2KG4. Elevate your products to new heights with this cutting-edge solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient assembly on circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

Standard rectangular shape makes it easy to integrate into various electronic devices and circuits.

Maximum Operating Temperature: 85 °C

Can withstand higher operating temperatures, making it suitable for use in a wide range of environments.

Minimum Operating Temperature: -25 °C

Can operate reliably in colder temperatures, providing versatility in usage scenarios.

Width: 5.3 mm

Compact width allows for space-saving integration in tight PCB layouts and designs.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes it energy-efficient and suitable for battery-powered devices.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable electrical connections.

Maximum Supply Current: 40.7 mA

Optimized supply current allows for efficient power usage and minimizes heat generation.

Technical Specifications

Other Function Consumer ICs DIR1703E/2KG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Current:

40.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

DIR1703E/2KG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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