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DIR1701E/2K

Texas Instruments

DIR1701E/2K by Texas Instruments

DIR1701E/2K by Texas Instruments is a consumer IC with 28 terminals, operating at temperatures from -25 to 85°C. It has a supply voltage range of 3-3.6V and max current of 40.7mA. This rectangular-shaped IC in plastic/epoxy package is ideal for audio processing applications requiring small outline design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,583 parts In-Stock

1+ parts

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7,583

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Digiode

USA . 200 parts In-Stock

1+ parts

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200

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,000 parts In-Stock

1+ parts

$1.002

100+ parts

-

1k+ parts

$1.883

10k+ parts

-

1,000

$1.002

-

$1.883

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ChromeModa Solutions

Germany . 6,229 parts In-Stock

1+ parts

$1.126

100+ parts

$0.923

1k+ parts

-

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6,229

$1.126

$0.923

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IDEA Electronic Components Group

UK . 266 parts In-Stock

1+ parts

$1.126

100+ parts

-

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$1.013

10k+ parts

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266

$1.126

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$1.013

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$5.603

100+ parts

-

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627

$5.603

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One Stop Electronics

USA . 294 parts In-Stock

1+ parts

$14.800

100+ parts

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294

$14.800

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Corphita

USA . 1,907 parts In-Stock

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1,907

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Northwest PG Solutions

USA . 1,216 parts In-Stock

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1,216

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DigiPath Technology Company

USA . 654 parts In-Stock

1+ parts

-

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$1.015

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654

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$1.015

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Native Components

USA . 128 parts In-Stock

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128

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Overview

Elevate your electronics with the DIR1701E/2K by Texas Instruments, a top-quality consumer IC that delivers unmatched performance and reliability. Ideal for a variety of applications, this compact rectangular package boasts a small outline and shrink pitch design, making it a versatile choice for your projects. With a power supply of 3.3V and dual terminal positions, this innovative IC offers exceptional value and benefits to customers seeking high-quality solutions for their electronic needs. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is commonly used in consumer ICs for its durability and heat resistance, ensuring a reliable performance.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and cost during production.

Power Supplies (V): 3.3

Operating at 3.3V allows for compatibility with a wide range of electronic devices, making this IC versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this IC can withstand rigorous usage in various environments.

Width: 5.3 mm

Compact width of 5.3mm saves valuable space on the circuit board, ideal for compact electronic devices.

Minimum Supply Voltage (Vsup): 3 V

With a minimum supply voltage of 3V, this IC can operate efficiently with low power consumption.

Maximum Supply Current: 40.7 mA

Capable of handling a maximum supply current of 40.7mA, this IC is suitable for applications requiring high power output.

Technical Specifications

Other Function Consumer ICs DIR1701E/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

10.2 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

40.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Trade Compliance

DIR1701E/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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