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DIR1703E/2K

Texas Instruments

DIR1703E/2K by Texas Instruments

DIR1703E/2K by Texas Instruments is a consumer IC with 28 terminals in a small outline package. It operates b/w -25°C to 85°C, with supply voltage ranging from 3V to 3.6V. Ideal for applications requiring high-temperature resistance and compact design.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,623 parts In-Stock

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5,623

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Digiode

USA . 3,363 parts In-Stock

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3,363

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Cyclops Electronics Ltd

UK . 380 parts In-Stock

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380

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Parana Technologies

USA . 1,366 parts In-Stock

1+ parts

$1.938

100+ parts

-

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$2.473

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1,366

$1.938

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$2.473

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DigiPath Technology Company

USA . 1,224 parts In-Stock

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$2.134

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$1.964

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1,224

$2.134

$1.964

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IDEA Electronic Components Group

UK . 394 parts In-Stock

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$2.178

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$1.960

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394

$2.178

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$1.960

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ChromeModa Solutions

Germany . 205 parts In-Stock

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$2.178

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$1.786

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205

$2.178

$1.786

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Northwest PG Solutions

USA . 294 parts In-Stock

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$3.200

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$3.200

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One Stop Electronics

USA . 825 parts In-Stock

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$6.800

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$6.800

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AZTECH Wire

Italy . 681 parts In-Stock

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$9.435

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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Metaverse IC Inc.

Canada . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,689 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,459 parts In-Stock

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Lixinc

USA . 3,459 parts In-Stock

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Microchip USA

USA . 2,178 parts In-Stock

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Native Components

USA . 823 parts In-Stock

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$2.822

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823

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$2.822

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Corphita

USA . 200 parts In-Stock

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200

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Overview

Upgrade your consumer electronics with the cutting-edge DIR1703E/2K by Texas Instruments. Manufactured with precision and expertise, this small outline, shrink pitch IC offers unrivaled quality and reliability. Ideal for a wide range of applications, this consumer circuit product provides seamless integration and optimal performance. Experience the value of superior technology with the DIR1703E/2K, delivering maximum supply current of 40.7 mA and a peak reflow temperature of 260°C. Elevate your projects with Texas Instruments' innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Package Shape: RECTANGULAR

Rectangular package shape is standard and compatible with various mounting options, making it versatile for different applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliable performance even in demanding thermal conditions.

Width: 5.3 mm

Compact width dimension saves space on the circuit board, making it suitable for designs with limited real estate.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement makes it energy efficient and suitable for battery-powered devices.

Terminal Position: DUAL

Dual terminal position allows for enhanced connectivity options and flexibility in circuit design.

Maximum Supply Current: 40.7 mA

Moderate maximum supply current ensures efficient power usage and prevents overload risks.

Technical Specifications

Other Function Consumer ICs DIR1703E/2K attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Maximum Supply Current:

40.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

DIR1703E/2K General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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