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DFDF2812ZHHAR

Texas Instruments

DFDF2812ZHHAR by Texas Instruments

DFDF2812ZHHAR by Texas Instruments is a 32-bit DSP with 16-bit data RAM and 19-bit address bus. It operates at up to 35 MHz, suitable for industrial applications requiring low power consumption. The package style is grid array, making it ideal for compact designs in digital signal processing systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,149 parts In-Stock

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Digiode

USA . 2,634 parts In-Stock

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2,634

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Distributors (Availability)

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Native Components

USA . 610 parts In-Stock

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$0.246

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-

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$0.236

610

$0.246

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$0.236

Northwest PG Solutions

USA . 438 parts In-Stock

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$0.270

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-

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$0.238

438

$0.270

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$0.238

AZTECH Wire

Italy . 877 parts In-Stock

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$17.829

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877

$17.829

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Parana Technologies

USA . 706 parts In-Stock

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$31.717

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$87.396

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706

$31.717

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$87.396

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One Stop Electronics

USA . 1,232 parts In-Stock

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$33.000

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$33.000

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DigiPath Technology Company

USA . 1,988 parts In-Stock

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$34.924

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$34.924

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ChromeModa Solutions

Germany . 2,926 parts In-Stock

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$35.637

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$29.222

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IDEA Electronic Components Group

UK . 837 parts In-Stock

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$35.637

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$33.855

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$32.073

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837

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$32.073

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Corohmni

South Africa . 58 parts In-Stock

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$84.804

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Corphita

USA . 3,228 parts In-Stock

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Overview

Unlock your potential with the DFDF2812ZHHAR by Texas Instruments, a cutting-edge Digital Signal Processor (DSP) designed for unparalleled performance and efficiency. Manufactured with precision and expertise, this top-of-the-line processor offers a wide range of applications in various industries. From industrial automation to automotive systems, the possibilities are endless. Experience seamless operation, enhanced functionality, and optimized power consumption with this innovative product. Elevate your projects to new heights with the DFDF2812ZHHAR - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications without adding unnecessary weight.

Maximum Supply Voltage: 2 V

A higher maximum supply voltage allows for flexibility in powering the DSP, ensuring stable operation even under varying voltage conditions.

CPU Family: C28X

Being part of the C28X CPU family ensures compatibility with existing systems and software, making it easier to integrate this DSP into projects.

Maximum Clock Frequency: 35 MHz

The high maximum clock frequency allows for fast data processing and responsiveness, making this DSP suitable for real-time applications.

Technology: CMOS

CMOS technology is known for low power consumption and high noise immunity, making this DSP an energy-efficient and reliable choice.

ROM Programmability: OTPROM

One-time programmable ROM provides secure and permanent storage for critical data, enhancing the reliability and security of the device.

Technical Specifications

Digital Signal Processors (DSPs) DFDF2812ZHHAR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

1.8V NOMINAL AVAILBALE @135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

35 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DFDF2812ZHHAR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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