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DDC232CKGXGR

Texas Instruments

DDC232CKGXGR by Texas Instruments

The Texas Instruments DDC232CKGXGR is a 32-channel ADC with 20-bit resolution and 0.05% linearity error. It operates at temperatures from 0 to 70°C, with a sample rate of 0.003125 MHz. Ideal for applications requiring precise analog-to-digital conversion in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,892 parts In-Stock

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Digiode

USA . 4,656 parts In-Stock

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4,656

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Distributors (Availability)

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Native Components

USA . 474 parts In-Stock

1+ parts

$0.183

100+ parts

-

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$0.176

474

$0.183

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$0.176

Northwest PG Solutions

USA . 1,928 parts In-Stock

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$0.201

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-

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$0.178

1,928

$0.201

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$0.178

One Stop Electronics

USA . 1,565 parts In-Stock

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$13.000

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1,565

$13.000

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AZTECH Wire

Italy . 276 parts In-Stock

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$16.624

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276

$16.624

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Parana Technologies

USA . 2,217 parts In-Stock

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$24.290

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$24.953

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2,217

$24.290

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$24.953

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DigiPath Technology Company

USA . 2,114 parts In-Stock

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$26.746

100+ parts

$24.606

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2,114

$26.746

$24.606

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ChromeModa Solutions

Germany . 6,007 parts In-Stock

1+ parts

$27.292

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$22.379

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6,007

$27.292

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IDEA Electronic Components Group

UK . 1,554 parts In-Stock

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$27.292

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$25.927

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$24.563

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1,554

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$25.927

$24.563

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Corphita

USA . 820 parts In-Stock

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Overview

Experience the unmatched precision and reliability of the DDC232CKGXGR Analog-to-Digital Converter by Texas Instruments. With 32 analog input channels and a maximum linearity error of just 0.05%, this cutting-edge device is ideal for a wide range of applications. From industrial automation to medical devices, this ADC offers unparalleled performance and accuracy. Trust in Texas Instruments' reputation for quality and innovation, and unlock new possibilities with the DDC232CKGXGR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability, ensuring the product can withstand various environmental conditions.

No. of Analog In Channels: 32

Higher number of analog input channels allow for more data to be processed simultaneously, making it suitable for complex applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and reducing assembly time.

No. of Bits: 20

20-bit resolution ensures high accuracy and precision in converting analog signals to digital data.

Maximum Linearity Error (EL): 0.05 %

Low linearity error ensures accurate conversion and reliable performance of the product.

Power Supplies (V): 3,5

Support for multiple power supply voltages provides flexibility in design and compatibility with various systems.

No. of Terminals: 64

Higher number of terminals allow for more connectivity options and better signal routing within the system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package style offers compact size, ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures stable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range allows for reliable operation in cold environments.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure connections during installation.

Maximum Seated Height: 1.45 mm

Low seated height saves space in the overall system design and allows for compact installation.

Width: 8 mm

Compact width dimension enables easy integration into circuit board layouts and tight spaces.

Length: 8 mm

Compact length dimension ensures the product can fit in small enclosures or tight spaces.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures the product meets standard operating conditions in commercial applications.

Maximum Analog Input Voltage: 5.25 V

Support for high analog input voltage allows for versatile use with a wide range of input signals.

Sample Rate: 0.003125 MHz

High sample rate enables fast and efficient conversion of analog signals to digital data.

Terminal Form: BALL

Ball terminal form provides secure connections and reliable signal transfer within the system.

Converter Type: ADC, DELTA-SIGMA

Delta-sigma converter type offers high resolution, low noise, and excellent stability for precision analog-to-digital conversion.

Nominal Supply Voltage: 5 V

Support for 5V nominal supply voltage ensures compatibility with standard power sources and systems.

Output Bit Code: BINARY, OFFSET BINARY

Output in binary and offset binary formats provides flexibility and compatibility with different data processing systems.

Terminal Pitch: 0.8 mm

Compact terminal pitch enables dense packing and efficient signal routing on circuit boards.

Output Format: SERIAL

Serial output format allows for easy data transmission and integration with a wide range of digital systems.

Technical Specifications

Analog-to-Digital Converters DDC232CKGXGR attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

32

No. of Functions:

1

No. of Bits:

20

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.05 %

Sample Rate:

3.125 kHz

Electrical Specifications

Power Supplies:

3,5 V

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Bottom

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA64,8X8,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B64

Qualified:

No

Trade Compliance

DDC232CKGXGR Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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