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DDC2256AZZF

Texas Instruments

DDC2256AZZF by Texas Instruments

The Texas Instruments DDC2256AZZF is a 24-bit ADC with 256 analog input channels. It features a delta-sigma converter type, binary output bit code, and operates at a sample rate of 0.017 MHz. Ideal for applications requiring precise analog-to-digital conversion in commercial temperature environments.

Median Price

$521.706

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,248 parts In-Stock

1+ parts

$335.741

100+ parts

$303.904

1k+ parts

$289.432

10k+ parts

-

1,248

$335.741

$303.904

$289.432

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DigiKey

USA . 72 parts In-Stock

1+ parts

$707.670

100+ parts

-

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-

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72

$707.670

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,762 parts In-Stock

1+ parts

$318.954

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3,762

$318.954

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Vyrian

USA . 4,539 parts In-Stock

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4,539

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Chip Stock

USA . 377 parts In-Stock

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377

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 473 parts In-Stock

1+ parts

$6.756

100+ parts

-

1k+ parts

$7.424

10k+ parts

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473

$6.756

-

$7.424

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DigiPath Technology Company

USA . 997 parts In-Stock

1+ parts

$7.439

100+ parts

$6.844

1k+ parts

-

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997

$7.439

$6.844

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ChromeModa Solutions

Germany . 4,007 parts In-Stock

1+ parts

$7.591

100+ parts

$6.225

1k+ parts

-

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4,007

$7.591

$6.225

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IDEA Electronic Components Group

UK . 1,617 parts In-Stock

1+ parts

$7.591

100+ parts

-

1k+ parts

$6.832

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1,617

$7.591

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$6.832

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Native Components

USA . 537 parts In-Stock

1+ parts

$13.720

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537

$13.720

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Northwest PG Solutions

USA . 892 parts In-Stock

1+ parts

$15.092

100+ parts

$13.583

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892

$15.092

$13.583

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Corphita

USA . 2,696 parts In-Stock

1+ parts

$302.167

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2,696

$302.167

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Microchip USA

USA . 1,049 parts In-Stock

1+ parts

$384.900

100+ parts

$374.640

1k+ parts

$369.510

10k+ parts

$364.370

1,049

$384.900

$374.640

$369.510

$364.370

Kepictronics

USA . 1,000 parts In-Stock

1+ parts

-

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1,000

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Overview

Experience the unparalleled precision and reliability of the Texas Instruments DDC2256AZZF Analog-to-Digital Converter. With 256 analog input channels and a 24-bit resolution, this top-of-the-line device is perfect for a wide range of applications. From industrial automation to medical instrumentation, this converter delivers accurate and efficient results every time. Trust in the quality and expertise of Texas Instruments to provide you with the best technology on the market. Elevate your projects with the DDC2256AZZF and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and cost-effective, making the product suitable for a wide range of applications.

No. of Analog In Channels: 256

The high number of analog input channels allows for versatile and complex signal processing capabilities.

Surface Mount: YES

Being surface mountable makes installation and integration of the product easy and efficient.

No. of Bits: 24

A higher number of bits results in higher resolution and accuracy in the conversion process.

Temperature Grade: COMMERCIAL

Suitable for commercial applications with moderate temperature requirements.

Technical Specifications

Analog-to-Digital Converters DDC2256AZZF attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

256

No. of Functions:

1

No. of Bits:

24

Output Bit Code:

Binary

Output Format:

Parallel

Sample Rate:

17 kHz

Electrical Specifications

Minimum Analog Input Voltage:

-2.5 V

Maximum Analog Input Voltage:

2.5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Bottom

No. of Terminals:

323

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.551 in (14 mm)

Length:

0.63 in (16 mm)

Maximum Seated Height:

0.065 in (1.66 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Code:

Standards and Codes

JESD-30 Code:

R-PBGA-B323

JESD-609 Code:

e1

Trade Compliance

DDC2256AZZF Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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