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DDC232CKZXGT

Texas Instruments

DDC232CKZXGT by Texas Instruments

The Texas Instruments DDC232CKZXGT is a 32-channel ADC with 20-bit resolution and 0.05% linearity error. It operates on 3.5V, has a sample rate of 0.0062 MHz, and uses delta-sigma conversion. Ideal for commercial applications requiring high precision analog-to-digital conversion in a compact grid array package.

Median Price

$92.769

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 931 parts In-Stock

1+ parts

$92.769

100+ parts

$89.979

1k+ parts

$69.751

10k+ parts

-

931

$92.769

$89.979

$69.751

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DigiKey

USA . 64 parts In-Stock

1+ parts

$170.340

100+ parts

$138.292

1k+ parts

$127.907

10k+ parts

-

64

$170.340

$138.292

$127.907

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$81.600

10k+ parts

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1,000

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-

$81.600

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,082 parts In-Stock

1+ parts

$88.131

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-

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3,082

$88.131

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Vyrian

USA . 5,647 parts In-Stock

1+ parts

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5,647

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Chip Stock

USA . 925 parts In-Stock

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925

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Cyclops Electronics Ltd

UK . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 612 parts In-Stock

1+ parts

$1.783

100+ parts

-

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-

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612

$1.783

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Northwest PG Solutions

USA . 692 parts In-Stock

1+ parts

$1.962

100+ parts

-

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692

$1.962

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Parana Technologies

USA . 1,313 parts In-Stock

1+ parts

$6.038

100+ parts

-

1k+ parts

$6.816

10k+ parts

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1,313

$6.038

-

$6.816

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$6.142

100+ parts

$5.589

1k+ parts

$5.036

10k+ parts

-

2,000

$6.142

$5.589

$5.036

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DigiPath Technology Company

USA . 2,000 parts In-Stock

1+ parts

$6.648

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2,000

$6.648

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ChromeModa Solutions

Germany . 1,630 parts In-Stock

1+ parts

$6.784

100+ parts

$5.563

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1,630

$6.784

$5.563

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IDEA Electronic Components Group

UK . 622 parts In-Stock

1+ parts

$6.784

100+ parts

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$6.106

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622

$6.784

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$6.106

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Corphita

USA . 187 parts In-Stock

1+ parts

$83.492

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187

$83.492

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Component Stockers USA

USA . 553 parts In-Stock

1+ parts

$105.210

100+ parts

$90.270

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553

$105.210

$90.270

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Corohmni

South Africa . 6 parts In-Stock

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$107.300

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6

$107.300

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Microchip USA

USA . 2,809 parts In-Stock

1+ parts

$147.450

100+ parts

$144.880

1k+ parts

$143.600

10k+ parts

$142.320

2,809

$147.450

$144.880

$143.600

$142.320

Lixinc

USA . 6,641 parts In-Stock

1+ parts

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6,641

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Overview

Elevate your analog-to-digital conversion experience with the DDC232CKZXGT by Texas Instruments. With a commitment to quality and precision, Texas Instruments delivers a cutting-edge converter that offers 32 channels for seamless data transformation. Perfect for a variety of applications, this square-shaped device boasts 20 bits of accuracy with a maximum linearity error of just 0.05%. With a low profile, fine pitch design and a commercial temperature grade, the DDC232CKZXGT provides unparalleled value and performance for your projects. Experience the benefits of Texas Instruments technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits inside.

No. of Analog In Channels: 32

Having 32 analog input channels allows for versatile and complex data acquisition and conversion.

Surface Mount: YES

Surface mount capability makes it easier to integrate into circuitry and saves space on a PCB.

No. of Bits: 20

With a high number of bits, this converter can provide more precise and accurate digital representations of analog signals.

Maximum Linearity Error (EL): 0.05%

The low linearity error ensures that the converted digital data closely matches the original analog signal.

Power Supplies (V): 3,5

Support for multiple power supply voltages adds flexibility to the device's use in different applications.

No. of Terminals: 64

Having a high number of terminals allows for connection to various components and interfaces.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact and efficient design for modern electronic devices.

Maximum Operating Temperature: 70 °C

The wide operating temperature range makes this converter suitable for use in various environments.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures adds versatility and reliability to the product.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to mount and integrate into circuitry.

Maximum Seated Height: 1.45 mm

Low seated height allows for compact PCB design and space-saving in electronic devices.

Width: 8 mm

The compact width of the device allows for efficient use of PCB space.

Peak Reflow Temperature °C: 260

With a high reflow temperature, this converter can withstand the soldering process during PCB assembly.

Length: 8 mm

The compact length of the device contributes to a space-saving PCB layout.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating environments.

Sample Rate: 0.0062 MHz

The high sample rate allows for fast and accurate conversion of analog signals to digital data.

Terminal Form: BALL

Ball terminal form offers reliable connections and ease of soldering during PCB assembly.

Converter Type: ADC, DELTA-SIGMA

Delta-sigma converter type provides high resolution and accuracy for converting analog signals.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is common and widely compatible with different electronic systems.

Output Bit Code: BINARY, OFFSET BINARY

Support for different output bit codes adds versatility and compatibility with various digital systems.

Terminal Pitch: 0.8 mm

Compact terminal pitch allows for high terminal density and efficient use of PCB space.

Output Format: SERIAL

Serial output format enables easy integration with digital systems and communication interfaces.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the device has a moderate level of moisture sensitivity during storage and handling.

Technical Specifications

Analog-to-Digital Converters DDC232CKZXGT attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

32

No. of Functions:

1

No. of Bits:

20

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary, Offset Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.05 %

Sample Rate:

6.2 kHz

Electrical Specifications

Power Supplies:

3,5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

3

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Form Factor

Terminal Position:

Bottom

No. of Terminals:

64

Terminal Form:

Terminal Pitch:

0.031 in (0.8 mm)

Surface Mount:

Yes

Width:

0.315 in (8 mm)

Length:

0.315 in (8 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Shape:

Package Equivalence Code:

BGA64,8X8,32

Package Code:

Standards and Codes

JESD-30 Code:

S-PBGA-B64

Qualified:

No

JESD-609 Code:

e1

Trade Compliance

DDC232CKZXGT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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