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DAC8831IDR

Texas Instruments

DAC8831IDR by Texas Instruments

DAC8831IDR by Texas Instruments is a 16-bit digital-to-analog converter (DAC) with a max analog output voltage of 2.5V. It has a fast settling time of 1us and operates at temperatures ranging from -40 to 85°C. This DAC is commonly used in industrial applications requiring precise analog signal generation.

Median Price

$10.569

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 20,684 parts In-Stock

1+ parts

$10.569

100+ parts

$9.232

1k+ parts

$6.367

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20,684

$10.569

$9.232

$6.367

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Distributors (In-Stock)

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Digiode

USA . 3,960 parts In-Stock

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$10.041

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3,960

$10.041

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Chip Stock

USA . 4,000 parts In-Stock

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Vyrian

USA . 3,161 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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Ampacity Inc.

Singapore . 20,503 parts In-Stock

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$8.980

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$8.980

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Corphita

USA . 3,311 parts In-Stock

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$9.512

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AZTECH Wire

Italy . 328 parts In-Stock

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$21.060

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$21.060

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Parana Technologies

USA . 2,288 parts In-Stock

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$22.369

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$23.043

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2,288

$22.369

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DigiPath Technology Company

USA . 128 parts In-Stock

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$24.631

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$22.661

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128

$24.631

$22.661

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ChromeModa Solutions

Germany . 6,206 parts In-Stock

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$25.134

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$20.610

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$25.134

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IDEA Electronic Components Group

UK . 52 parts In-Stock

1+ parts

$25.134

100+ parts

$23.877

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$22.621

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52

$25.134

$23.877

$22.621

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Lixinc

USA . 13,551 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,793 parts In-Stock

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Continental Prestige Electronics

USA . 5,205 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,862 parts In-Stock

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Argo Parts USA

USA . 2,094 parts In-Stock

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Kepictronics

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Experience the ultimate in precision and performance with the DAC8831IDR by Texas Instruments. As a leading manufacturer in digital-to-analog converters, Texas Instruments delivers unmatched quality and reliability. This versatile product is perfect for a wide range of applications, providing a maximum analog output voltage of 2.5V and a sample rate of 2 MHz. With its compact size and surface mount capability, the DAC8831IDR offers convenience without compromising on power. Trust in Texas Instruments to deliver exceptional value and innovation, empowering you to achieve your goals with confidence.

Feature Benefit Bullets

Maximum Analog Output Voltage: 2.5 V

The high maximum analog output voltage allows for the generation of a wide range of analog signals, making this converter suitable for applications that require precise voltage control.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components, ensuring the converter's long-term reliability.

Surface Mount: YES

The surface mount capability enables easy integration of the converter into circuit boards, making it ideal for compact electronic devices or applications with limited space available.

No. of Functions: 1

This converter focuses on a single function, simplifying its design and ensuring optimal performance in digital-to-analog conversion tasks.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient utilization of space on circuit boards, facilitating the design of compact and space-saving electronic systems.

No. of Bits: 16

With a high number of bits, this converter can achieve greater precision and accuracy in converting digital signals into analog outputs, making it suitable for applications where fine-grained control is required.

Maximum Settling Time: 1 us

The fast settling time ensures that the analog output stabilizes quickly after the input changes, allowing for high-speed signal processing and reducing potential distortion or artifacts.

Maximum Linearity Error (EL): 0.0061 %

The low linearity error percentage ensures accurate and faithful conversion from digital to analog signals, making this converter well-suited for applications that require high-quality and reliable analog output.

Power Supplies (V): 3/5

This converter can operate with two different power supply voltages, 3 V and 5 V, providing flexibility in addressing various system requirements or compatibility with different power sources.

No. of Terminals: 14

The 14 terminals allow for easy connection and integration with external circuitry, facilitating the interfacing of this converter with other components or devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space efficiency and ease of integration, making it suitable for applications where miniaturization is a key consideration.

Nominal Settling Time (tstl): 1 us

The nominal settling time ensures consistent and predictable performance in settling to the desired analog output value, enabling precise control in time-sensitive applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance allows for reliable operation even in demanding environments or under elevated temperature conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature tolerance, this converter can withstand cold environments, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish provides superior conductivity, corrosion resistance, and durability, ensuring stable and reliable electrical connections over the converter's lifespan.

Terminal Position: DUAL

Having a dual-terminal position allows for multiple options for connecting the converter, making it versatile and adaptable to various circuit designs or system layouts.

Maximum Seated Height: 1.75 mm

The compact maximum seated height allows for low-profile integration, making this converter suitable for applications that require minimal space usage or have height restrictions.

Width: 3.9 mm

With a narrow width, this converter enables efficient utilization of board space, making it suitable for space-constrained designs or systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures that the converter can withstand the soldering process without affecting its performance, simplifying the manufacturing and assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature tolerance, this converter can endure high-temperature soldering processes, ensuring reliable solder joints and enabling compatibility with various manufacturing techniques.

Minimum Analog Output Voltage: -2.5 V

The ability to generate a negative analog output voltage allows for versatile analog signal generation, expanding the converter's range of applications and compatibility with systems requiring negative voltage outputs.

Length: 8.65 mm

The compact length enables space-efficient integration into electronic systems, contributing to overall design compactness and miniaturization.

Temperature Grade: INDUSTRIAL

This converter is designed to operate reliably within industrial temperature ranges, making it suitable for deployment in demanding industrial environments and ensuring performance consistency under challenging conditions.

Sample Rate: 2 MHz

With a high sample rate of 2 MHz, this converter can accurately capture and convert analog signals with rapid variations or high-frequency components, making it suitable for applications that involve rapid signal processing or high-speed data acquisition.

Terminal Form: GULL WING

The gull wing terminal form ensures secure and reliable solder connections, facilitating the assembly process and contributing to the converter's long-term durability.

Maximum Supply Current: 0.02 mA

The low maximum supply current minimizes power consumption and heat dissipation, making this converter energy-efficient and suitable for battery-operated or low-power applications.

Input Format: SERIAL

This converter supports the serial input format, allowing for easy integration with microcontrollers or other digital devices that communicate via serial interfaces.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product excels at converting digital signals into accurate analog outputs, making it a reliable choice for applications that require high-quality analog signal generation.

Nominal Supply Voltage: 3 V

The nominal supply voltage of 3 V provides compatibility with standard voltage levels, simplifying power supply design and ensuring seamless integration with existing systems.

Terminal Pitch: 1.27 mm

With a small terminal pitch, this converter facilitates high-density mounting and space-saving designs, making it suitable for applications that require compact circuit board layouts.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level 2 rating ensures that the converter remains moisture-resistant, reducing the risk of moisture-related damage during transportation, storage, or assembly processes.

Input Bit Code: BINARY

This converter utilizes the binary input bit code format, making it compatible with a wide range of digital systems and simplifying the integration with binary-based signal processing architectures.

Technical Specifications

Digital-to-Analog Converters DAC8831IDR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

20 μA

Maximum Settling Time:

1 µs

Sample Rate:

2 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

-2.5 V

Maximum Analog Output Voltage:

2.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

14

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.341 in (8.65 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Trade Compliance

DAC8831IDR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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