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DAC8830IDT

Texas Instruments

DAC8830IDT by Texas Instruments

DAC8830IDT by Texas Instruments is a 16-bit D/A converter with max output voltage of 5.5V and linearity error of 0.0061%. Ideal for industrial applications, it operates b/w -40 to 85°C, settling in just 1us. With low supply current of 0.02mA, this surface-mount device offers precise analog outputs in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,550 parts In-Stock

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Chip Stock

USA . 3,910 parts In-Stock

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3,910

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Digiode

USA . 2,164 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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Corohmni

South Africa . 69 parts In-Stock

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$11.286

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69

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One Stop Electronics

USA . 1,241 parts In-Stock

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$12.000

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$12.000

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AZTECH Wire

Italy . 604 parts In-Stock

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$12.247

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Ampacity Inc.

Singapore . 1,601 parts In-Stock

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$14.000

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$14.000

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Parana Technologies

USA . 515 parts In-Stock

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$16.315

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$16.622

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515

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ChromeModa Solutions

Germany . 2,424 parts In-Stock

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$18.332

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$15.032

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$18.332

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IDEA Electronic Components Group

UK . 2,060 parts In-Stock

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$18.332

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$17.415

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$16.499

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2,060

$18.332

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QUARKTWIN TECHNOLOGY LTD

USA . 29,873 parts In-Stock

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Microchip USA

USA . 4,765 parts In-Stock

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Argo Parts USA

USA . 2,903 parts In-Stock

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Continental Prestige Electronics

USA . 2,815 parts In-Stock

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Corphita

USA . 1,784 parts In-Stock

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DigiPath Technology Company

USA . 1,249 parts In-Stock

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$16.528

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$16.528

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock endless possibilities with the Texas Instruments DAC8830IDT Digital-to-Analog Converter. Crafted by a trusted manufacturer known for excellence, this converter offers unparalleled quality and reliability. Ideal for a wide range of applications, this product provides precise analog output voltage with minimal linearity error. Experience seamless performance and superior results with the DAC8830IDT, setting a new standard in digital-to-analog conversion technology. Elevate your projects with this innovative solution that delivers value, efficiency, and unmatched benefits to customers.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Provides a high maximum output voltage, allowing for versatile signal generation capabilities.

No. of Bits: 16

Offers high resolution for accurate conversion of digital signals to analog signals.

Power Supplies (V): 3/5

Provides flexibility in power supply options for different applications.

Maximum Operating Temperature: 85 °C

Suitable for use in a wide range of industrial environments with varying temperatures.

Input Format: SERIAL

Supports serial input format for ease of integration with other digital systems.

Technical Specifications

Digital-to-Analog Converters DAC8830IDT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

1 µs

Maximum Supply Current:

20 μA

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Form Factor

No. of Terminals:

8

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G8

Trade Compliance

DAC8830IDT Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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