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DAC8802IPWRG4

Texas Instruments

DAC8802IPWRG4 by Texas Instruments

DAC8802IPWRG4 by Texas Instruments is a 14-bit D/A converter with 10V max analog output voltage, 0.5us settling time, and 0.0061% linearity error. Ideal for industrial applications requiring precise analog signal generation in a compact package with surface mount capability.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

< 1k

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Vyrian

USA . 572 parts In-Stock

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Digiode

USA . 119 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Ampacity Inc.

Singapore . 1,138 parts In-Stock

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$1.000

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One Stop Electronics

USA . 1,495 parts In-Stock

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AZTECH Wire

Italy . 808 parts In-Stock

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Parana Technologies

USA . 783 parts In-Stock

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$18.139

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DigiPath Technology Company

USA . 1,279 parts In-Stock

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$19.794

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$18.211

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ChromeModa Solutions

Germany . 6,864 parts In-Stock

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$20.198

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$16.562

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IDEA Electronic Components Group

UK . 217 parts In-Stock

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$19.188

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$18.178

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Continental Prestige Electronics

USA . 5,395 parts In-Stock

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Argo Parts USA

USA . 2,669 parts In-Stock

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Microchip USA

USA . 1,019 parts In-Stock

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Kepictronics

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Elevate your electronic designs with the DAC8802IPWRG4 from Texas Instruments, a leading manufacturer known for top-quality components. As part of the Digital-to-Analog Converters category, this product offers precision and reliability, making it ideal for applications requiring accurate analog output voltage. With fast settling times and low linearity error, customers can trust in the superior performance of this device. Experience the value and benefits of seamless integration, high-speed sampling rates, and industrial-grade temperature tolerance. Upgrade your projects with the DAC8802IPWRG4 and unlock new possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation and integration into circuit boards.

Input/Output Type: COMMON

Simplified interface for ease of use.

Maximum Clock Frequency (fCLK): 66 MHz

High clock frequency allows for efficient data processing.

Memory IC Type: STANDARD SRAM

Standard SRAM design ensures compatibility with various systems.

Technical Specifications

Digital-to-Analog Converters DAC8802IPWRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0061 %

Nominal Settling Time (tstl):

500 ns

Maximum Supply Current:

5 μA

Maximum Settling Time:

500 ns

Sample Rate:

2 MHz

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

16

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.026 in (0.65 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.197 in (5 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSSOP16,.25

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Trade Compliance

DAC8802IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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