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DAC7571IDBVRG4

Texas Instruments

DAC7571IDBVRG4 by Texas Instruments

DAC7571IDBVRG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 10us. Ideal for industrial applications, it operates b/w -40 to 105 °C with low power consumption at 0.2mA supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 29,700 parts In-Stock

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29,700

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Vyrian

USA . 7,953 parts In-Stock

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7,953

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Digiode

USA . 4,390 parts In-Stock

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4,390

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HZD GmbH

Germany . 2,600 parts In-Stock

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2,600

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Distributors (Availability)

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$7.786

100+ parts

$7.396

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$7.396

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15

$7.786

$7.396

$7.396

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AZTECH Wire

Italy . 287 parts In-Stock

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$14.121

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287

$14.121

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Parana Technologies

USA . 1,569 parts In-Stock

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$15.611

100+ parts

$1,449.764

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$14.050

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1,569

$15.611

$1,449.764

$14.050

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Semicontronic

India . 1,162 parts In-Stock

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$16.000

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$15.600

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$15.520

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$16.000

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$15.520

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DigiPath Technology Company

USA . 631 parts In-Stock

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$17.190

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$15.815

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631

$17.190

$15.815

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ChromeModa Solutions

Germany . 5,561 parts In-Stock

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$17.541

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$14.384

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IDEA Electronic Components Group

UK . 689 parts In-Stock

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$17.541

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$16.664

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$15.787

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689

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Aztec Data Supply Inc.

USA . 3,886 parts In-Stock

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$18.540

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Ampacity Inc.

Singapore . 1,163 parts In-Stock

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$19.000

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Corohmni

South Africa . 542 parts In-Stock

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$21.496

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542

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One Stop Electronics

USA . 624 parts In-Stock

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$36.000

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624

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Kepictronics

USA . 21,000 parts In-Stock

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Corphita

USA . 4,721 parts In-Stock

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Microchip USA

USA . 3,575 parts In-Stock

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Continental Prestige Electronics

USA . 3,514 parts In-Stock

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Glotronic Ltd.

UK . 2,400 parts In-Stock

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Argo Parts USA

USA . 1,101 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Unlock the power of precision with the Texas Instruments DAC7571IDBVRG4 Digital-to-Analog Converter. Crafted with excellence by a trusted manufacturer, this cutting-edge technology offers unparalleled accuracy and reliability for a range of applications. From industrial automation to audio equipment, this compact and versatile device delivers seamless performance with minimal power consumption. Elevate your projects with the unmatched quality and efficiency of the DAC7571IDBVRG4 and experience the difference that superior technology can make.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

The high maximum analog output voltage of 5.5 V allows for a wide range of output levels, making this converter suitable for a variety of applications.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

The surface mount capability makes installation and integration of this converter easy and efficient.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact design, saving space in electronic applications.

No. of Bits: 12

With 12 bits of resolution, this converter offers high precision in converting digital signals to analog output.

Maximum Settling Time: 10 us

The fast settling time of 10 microseconds ensures quick and accurate conversion of digital signals into analog output.

Maximum Linearity Error (EL): 0.195 %

The low maximum linearity error of 0.195% ensures accurate and consistent analog output.

Power Supplies (V): 3/5

Compatible with both 3V and 5V power supplies, offering flexibility in power input options.

No. of Terminals: 6

With 6 terminals, this converter simplifies the connection process and enhances overall usability.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The small outline, low profile, and shrink pitch package style provides a compact and space-saving solution for electronic designs.

Technical Specifications

Digital-to-Analog Converters DAC7571IDBVRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.195 %

Nominal Settling Time (tstl):

8 µs

Maximum Supply Current:

200 μA

Maximum Settling Time:

10 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

6

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.037 in (0.95 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.063 in (1.6 mm)

Length:

0.114 in (2.9 mm)

Maximum Seated Height:

0.057 in (1.45 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Low Profile, Shrink Pitch

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Trade Compliance

DAC7571IDBVRG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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