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DAC8562TDSCT

Texas Instruments

DAC8562TDSCT by Texas Instruments

D/A CONVERTER; Temperature Grade: AUTOMOTIVE; Terminal Form: NO LEAD; No. of Terminals: 10; Package Code: VSON; Package Shape: SQUARE;

Median Price

$8.977

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 750 parts In-Stock

1+ parts

$8.977

100+ parts

$7.319

1k+ parts

$4.879

10k+ parts

-

750

$8.977

$7.319

$4.879

-

Rochester

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$7.320

1k+ parts

$6.550

10k+ parts

$6.170

39

-

$7.320

$6.550

$6.170

Verical

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$9.150

1k+ parts

$8.188

10k+ parts

$7.713

39

-

$9.150

$8.188

$7.713

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,357 parts In-Stock

1+ parts

$6.441

100+ parts

-

1k+ parts

-

10k+ parts

-

4,357

$6.441

-

-

-

Vyrian

USA . 7,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,014

-

-

-

-

Chip Stock

USA . 3,180 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,180

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 559 parts In-Stock

1+ parts

$1.601

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$1.601

-

-

-

Northwest PG Solutions

USA . 1,069 parts In-Stock

1+ parts

$1.762

100+ parts

-

1k+ parts

-

10k+ parts

-

1,069

$1.762

-

-

-

Corphita

USA . 3,534 parts In-Stock

1+ parts

$6.102

100+ parts

-

1k+ parts

-

10k+ parts

-

3,534

$6.102

-

-

-

Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$10.316

100+ parts

$9.388

1k+ parts

$8.459

10k+ parts

-

450

$10.316

$9.388

$8.459

-

Parana Technologies

USA . 498 parts In-Stock

1+ parts

$15.488

100+ parts

-

1k+ parts

$15.865

10k+ parts

-

498

$15.488

-

$15.865

-

AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$16.380

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$16.380

-

-

-

ChromeModa Solutions

Germany . 5,949 parts In-Stock

1+ parts

$17.402

100+ parts

$14.270

1k+ parts

-

10k+ parts

-

5,949

$17.402

$14.270

-

-

IDEA Electronic Components Group

UK . 1,875 parts In-Stock

1+ parts

$17.402

100+ parts

$16.532

1k+ parts

$15.662

10k+ parts

-

1,875

$17.402

$16.532

$15.662

-

DigiPath Technology Company

USA . 811 parts In-Stock

1+ parts

-

100+ parts

$15.690

1k+ parts

-

10k+ parts

-

811

-

$15.690

-

-

Technical Specifications

Digital-to-Analog Converters DAC8562TDSCT attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Serial

Input Bit Code:

Binary

Nominal Settling Time (tstl):

7 µs

Maximum Settling Time:

7 µs

Sample Rate:

100 kHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

5.5 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

10

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.118 in (3 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.031 in (0.8 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Trade Compliance

DAC8562TDSCT Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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