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DAC811JPG4

Texas Instruments

DAC811JPG4 by Texas Instruments

DAC811JPG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of ±10 V. It features a settling time of 4 us and linearity error of 0.0244%. Ideal for applications requiring precise analog signal generation in commercial temperature range, it operates on ±12/±15 V power supplies with low supply current of 35 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,499 parts In-Stock

1+ parts

-

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4,499

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Digiode

USA . 2,418 parts In-Stock

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-

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2,418

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Distributors (Availability)

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Native Components

USA . 137 parts In-Stock

1+ parts

$5.515

100+ parts

-

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137

$5.515

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Parana Technologies

USA . 220 parts In-Stock

1+ parts

$10.363

100+ parts

-

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$10.882

10k+ parts

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220

$10.363

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$10.882

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DigiPath Technology Company

USA . 1,027 parts In-Stock

1+ parts

$11.411

100+ parts

$10.498

1k+ parts

-

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1,027

$11.411

$10.498

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ChromeModa Solutions

Germany . 4,034 parts In-Stock

1+ parts

$11.644

100+ parts

$9.548

1k+ parts

-

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4,034

$11.644

$9.548

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IDEA Electronic Components Group

UK . 859 parts In-Stock

1+ parts

$11.644

100+ parts

$11.062

1k+ parts

$10.480

10k+ parts

-

859

$11.644

$11.062

$10.480

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AZTECH Wire

Italy . 710 parts In-Stock

1+ parts

$13.754

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710

$13.754

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One Stop Electronics

USA . 409 parts In-Stock

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$17.000

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409

$17.000

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Northwest PG Solutions

USA . 2,242 parts In-Stock

1+ parts

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$5.405

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2,242

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$5.405

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Corphita

USA . 736 parts In-Stock

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736

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Microchip USA

USA . 416 parts In-Stock

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416

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Overview

Unlock the power of precision with the Texas Instruments DAC811JPG4 Digital-to-Analog Converter. Crafted by a renowned manufacturer, this versatile component boasts exceptional quality and reliability. Ideal for a wide range of applications, this converter delivers seamless performance and accuracy, making it an essential tool for any project. Experience the value and benefits of this innovative product, offering customers unparalleled advantages and cutting-edge technology. Elevate your designs with the DAC811JPG4 and see the difference for yourself.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

High maximum analog output voltage allows for a wide range of output signals, making this DAC suitable for various applications requiring different output levels.

No. of Bits: 12

12-bit resolution provides finer granularity and accuracy in converting digital signals to analog, resulting in high precision output.

Maximum Settling Time: 4 us

Fast settling time ensures that the output quickly stabilizes after changes in input, enhancing the responsiveness of the DAC.

Temperature Grade: COMMERCIAL

Commercial grade temperature range allows for reliable operation in typical environmental conditions, making this DAC suitable for a wide range of applications.

Input Bit Code: BINARY, OFFSET BINARY, 2'S COMPLEMENT BINARY

Support for different input bit codes provides flexibility in interfacing with various digital systems, enhancing the compatibility of this DAC.

Technical Specifications

Digital-to-Analog Converters DAC811JPG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

Bipolar

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary, Offset Binary, 2's Complement Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

3 µs

Maximum Supply Current:

35 mA

Maximum Settling Time:

4 µs

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

12 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,±12/±15 V

Nominal Negative Supply Voltage:

-12 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.1 in (2.54 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

No

Width:

0.6 in (15.24 mm)

Length:

1.472 in (37.4 mm)

Maximum Seated Height:

0.25 in (6.35 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

In-Line

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e4

Trade Compliance

DAC811JPG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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