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DAC7551IDRNRG4

Texas Instruments

DAC7551IDRNRG4 by Texas Instruments

DAC7551IDRNRG4 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 5.5V and settling time of 5us. Ideal for industrial applications, it operates in temperature range -40 to 105 °C, with low power consumption at 0.2mA supply current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 6,500 parts In-Stock

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Digiode

USA . 4,891 parts In-Stock

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Vyrian

USA . 3,235 parts In-Stock

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One Stop Electronics

USA . 265 parts In-Stock

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$3.000

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265

$3.000

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Parana Technologies

USA . 907 parts In-Stock

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$8.799

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$9.484

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907

$8.799

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$9.484

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DigiPath Technology Company

USA . 980 parts In-Stock

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$9.688

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980

$9.688

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ChromeModa Solutions

Germany . 3,089 parts In-Stock

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$9.886

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$8.107

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$8.107

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

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$9.886

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$9.392

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$8.897

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$8.897

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AZTECH Wire

Italy . 762 parts In-Stock

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$19.292

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Perfect Parts

USA . 36,960 parts In-Stock

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Microchip USA

USA . 10,346 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,723 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,602 parts In-Stock

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Corphita

USA . 3,104 parts In-Stock

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Northwest PG Solutions

USA . 2,238 parts In-Stock

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Native Components

USA . 350 parts In-Stock

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Overview

Unlock the power of precision with the DAC7551IDRNRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unrivaled quality and reliability in digital-to-analog converters. This versatile product offers a wide range of applications, providing customers with exceptional value and performance. Experience seamless integration, enhanced functionality, and superior results with the DAC7551IDRNRG4, setting new standards for excellence in industrial-grade technology. Elevate your projects with Texas Instruments and discover the endless possibilities that await with this innovative solution.

Feature Benefit Bullets

Maximum Analog Output Voltage: 5.5 V

Higher maximum analog output voltage allows for greater flexibility and range in the output signal, making this product suitable for a variety of applications.

No. of Bits: 12

Having 12 bits allows for higher resolution and accuracy in the analog-to-digital conversion process, making the output signal more precise.

Maximum Settling Time: 5 us

Fast settling time ensures quick and accurate conversion of digital signals to analog output, reducing latency and improving overall performance.

Power Supplies (V): 3/5

Support for dual power supplies of 3V and 5V provides flexibility in the choice of power source, making it adaptable to various system requirements.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, this product can withstand industrial environments and extended periods of use without overheating.

Sample Rate: 0.5 MHz

High sample rate of 0.5 MHz allows for fast and efficient conversion of digital signals to analog, ensuring smooth and accurate output.

Technical Specifications

Digital-to-Analog Converters DAC7551IDRNRG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Sub-Category:

Other Converters

Input Format:

Serial

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

5 µs

Maximum Supply Current:

200 μA

Maximum Settling Time:

5 µs

Sample Rate:

500 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3 V

Minimum Analog Output Voltage:

0 V

Maximum Analog Output Voltage:

5.5 V

Power Supplies:

3/5 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

105 °C (221 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

1

Form Factor

No. of Terminals:

12

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel/Palladium/Gold/Silver

Surface Mount:

Yes

Width:

0.079 in (2 mm)

Length:

0.118 in (3 mm)

Maximum Seated Height:

0.024 in (0.6 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

SOLCC12,.08,20

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Trade Compliance

DAC7551IDRNRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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