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DAC7725UBG4

Texas Instruments

DAC7725UBG4 by Texas Instruments

DAC7725UBG4 by Texas Instruments is a 12-bit digital-to-analog converter (DAC) with a max analog output voltage of 10V. It operates on power supplies of 5V and ±15V, making it suitable for industrial applications requiring precise analog signal generation.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 8,733 parts In-Stock

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Chip Stock

USA . 5,160 parts In-Stock

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Digiode

USA . 2,921 parts In-Stock

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Nova Conductors

Japan . 200 parts In-Stock

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Parana Technologies

USA . 2,097 parts In-Stock

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$15.478

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$15.859

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$15.478

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One Stop Electronics

USA . 1,366 parts In-Stock

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$16.000

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$16.000

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DigiPath Technology Company

USA . 2,356 parts In-Stock

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$17.043

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$15.680

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ChromeModa Solutions

Germany . 3,779 parts In-Stock

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$17.391

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$14.261

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IDEA Electronic Components Group

UK . 2,119 parts In-Stock

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$17.391

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$16.521

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$15.652

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AZTECH Wire

Italy . 505 parts In-Stock

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$19.444

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$19.444

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Semicontronic

India . 990 parts In-Stock

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$21.000

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$20.475

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$20.370

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$21.000

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Corohmni

South Africa . 998 parts In-Stock

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Advanced Electronics

New Zealand . 15 parts In-Stock

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$24.777

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$23.538

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$23.538

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Ampacity Inc.

Singapore . 967 parts In-Stock

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$25.000

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Component Stockers USA

USA . 398 parts In-Stock

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$99.990

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Continental Prestige Electronics

USA . 5,694 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Argo Parts USA

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Corphita

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Bastille Electronics

Australia . 1,000 parts In-Stock

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Microchip USA

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Overview

Experience superior quality and performance with the DAC7725UBG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures exceptional reliability and innovation. Designed for digital-to-analog conversion, this product opens up a world of possibilities in various applications. With its maximum analog output voltage of 10V and quick settling time of just 10µs, it delivers precise and accurate results. Its compact size and surface mount capability make it versatile and easy to integrate into any project. Explore the value, benefits, and advantages that the DAC7725UBG4 offers, and unlock unparalleled potential for your next venture.

Feature Benefit Bullets

Maximum Analog Output Voltage: 10 V

This high voltage output allows for compatibility with a wide range of audio and video equipment, making it a versatile choice for digital-to-analog conversion.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and reliability, ensuring the longevity of the product in various environmental conditions.

Surface Mount: YES

The surface mount capability of this converter makes it easy to integrate into compact electronic devices, saving valuable space and enabling efficient circuit design.

No. of Functions: 1

With a single function, this digital-to-analog converter simplifies the design and implementation process, reducing complexity and potential points of failure.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into standardized electronic setups and ensures compatibility with commonly used mounting techniques.

No. of Bits: 12

The 12-bit resolution of this converter provides precise and accurate analog output, resulting in high-quality audio and video signals for a superior user experience.

Maximum Settling Time: 10 us

The quick settling time ensures minimal delay and distortion in the analog output, allowing for smooth and seamless transitions between digital and analog signals.

Maximum Linearity Error (EL): 0.0244%

This low linearity error ensures that the digital-to-analog conversion maintains accuracy and fidelity, producing faithful reproductions of the original signals.

Power Supplies (V): 5,15/+-15

With multiple power supply options, including positive and negative voltage inputs, this converter offers flexibility in system integration and compatibility with various power sources.

No. of Terminals: 28

The 28 terminals provide ample connectivity options, facilitating easy integration into complex electronic systems and enabling versatile signal routing.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for space-efficient placement on circuit boards, enabling compact designs and efficient use of available area.

Nominal Settling Time (tstl): 8 us

This nominal settling time ensures accurate and stable analog output within a short duration, reducing potential signal distortion and maintaining high-quality conversions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows for reliable performance in demanding industrial environments, ensuring the converter functions optimally under extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range makes this converter suitable for a wide range of applications, including those in harsh climates or environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finishes enhances conductivity, durability, and corrosion resistance, leading to reliable and long-lasting operation.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient wiring options, making it easier to integrate the converter into existing systems or design new setups.

Maximum Seated Height: 2.65 mm

The compact maximum seated height ensures compatibility with space-restricted designs, allowing for efficient placement and integration into electronic systems.

Width: 7.5 mm

The narrow width of the converter aids in space-saving integration without sacrificing performance, making it suitable for applications where board space is limited.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the converter can withstand the soldering process without damage or compromised functionality, simplifying the assembly process.

Minimum Analog Output Voltage: -10 V

With the ability to provide negative analog output voltage, this converter offers versatility in generating both positive and negative analog signals, expanding its range of applications.

Length: 17.9 mm

The compact length of the converter allows for flexible placement on circuit boards, accommodating various design constraints and allowing for efficient use of space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this converter operates reliably and efficiently in harsh environmental conditions, making it a suitable choice for demanding industrial setups.

Sample Rate: 0.1 MHz

This high sample rate enables the converter to handle data at a fast pace, ensuring accurate and timely generation of analog signals for real-time applications.

Technology: CMOS

The use of CMOS technology provides low power consumption, making this converter energy-efficient and suitable for battery-operated devices or systems sensitive to power usage.

Terminal Form: GULL WING

The gull wing terminal form simplifies the soldering and mounting process, ensuring secure connections and ease of integration into electronic assemblies.

Maximum Supply Current: 8.5 mA

The low maximum supply current requirement contributes to energy efficiency and minimizes power consumption, making this converter suitable for portable or low-power applications.

Input Format: PARALLEL, WORD

With support for parallel input format and word-based data transmission, this converter accommodates a variety of digital input formats, enhancing compatibility with different systems.

Converter Type: D/A CONVERTER

As a digital-to-analog converter, this product provides a vital function in converting digital signals to analog, enabling the interfacing of digital devices with analog systems.

Nominal Supply Voltage: 15 V

The nominal supply voltage of 15 V ensures compatibility with common power sources, simplifying integration and operation in various electronic setups.

Nominal Negative Supply Voltage: -15 V

With a nominal negative supply voltage, this converter allows for the generation of negative analog output, expanding its range of applications and providing versatility in signal generation.

Terminal Pitch: 1.27 mm

The precise 1.27 mm terminal pitch enables easy soldering and wiring within electronic assemblies, ensuring reliable connections and smooth integration.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that this converter can withstand exposure to moderate moisture, allowing for use in humid environments without compromising performance.

Input Bit Code: BINARY

The support for binary input bit code ensures compatibility with standard digital systems and simplifies signal decoding, making this converter compatible with a wide range of applications.

Technical Specifications

Digital-to-Analog Converters DAC7725UBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Binary

Maximum Linearity Error (EL):

0.0244 %

Nominal Settling Time (tstl):

8 µs

Maximum Supply Current:

8.5 mA

Maximum Settling Time:

10 µs

Sample Rate:

100 kHz

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

15 V

Minimum Analog Output Voltage:

-10 V

Maximum Analog Output Voltage:

10 V

Power Supplies:

5,15/±15 V

Nominal Negative Supply Voltage:

-15 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

28

Terminal Form:

Terminal Position:

Dual

Terminal Pitch:

0.05 in (1.27 mm)

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.705 in (17.9 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Small Outline

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Standards and Codes

Qualified:

No

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Trade Compliance

DAC7725UBG4 Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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