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DAC5687IPZP

Texas Instruments

DAC5687IPZP by Texas Instruments

DAC5687IPZP by Texas Instruments is a 16-bit D/A converter with max analog output voltage of 4.1V and sample rate of 500MHz. Ideal for industrial applications, it operates b/w -40 to 85°C and features CMOS technology with parallel input format.

Median Price

$59.785

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Arrow

USA . 75 parts In-Stock

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Texas Instruments

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Chip1Stop

Japan . 90 parts In-Stock

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$53.100

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$47.900

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DigiKey

USA . 90 parts In-Stock

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$79.110

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$59.074

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Rochester

USA . 26 parts In-Stock

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$52.450

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$46.930

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$44.170

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Verical

USA . 26 parts In-Stock

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$65.563

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$58.663

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$55.212

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Distributors (In-Stock)

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Freelance Electronics

USA . 20 parts In-Stock

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$22.311

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$23.426

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$22.311

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Digiode

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$41.800

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DigiKey Marketplace

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Vyrian

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Chip Stock

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Bristol Electronics

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ACDS - Activité Composants Distribution Service

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Dan-Mar Components

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Netsource Technology, Inc.

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Speed Components Ltd

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ECAB

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Atlantic Semiconductor

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Elcom Components

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Semi Source

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Prism Electronics

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Semtec, LLC

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Sea View Technologies

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Distributors (Availability)

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Parana Technologies

USA . 990 parts In-Stock

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$23.151

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$23.786

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DigiPath Technology Company

USA . 422 parts In-Stock

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$25.492

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$23.452

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ChromeModa Solutions

Germany . 2,907 parts In-Stock

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$21.330

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IDEA Electronic Components Group

UK . 387 parts In-Stock

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$24.711

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Corphita

USA . 731 parts In-Stock

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Native Components

USA . 838 parts In-Stock

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Northwest PG Solutions

USA . 760 parts In-Stock

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Lixinc

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Metaverse IC Inc.

Canada . 7,236 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,737 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

Germany . 3,158 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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GreenTree Electronics

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Cyclops Electronics Ltd (Excess)

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Overview

Experience unparalleled precision and reliability with the Texas Instruments DAC5687IPZP Digital-to-Analog Converter. Known for their cutting-edge technology and superior quality, Texas Instruments delivers a product that exceeds expectations in industrial applications. With a maximum analog output voltage of 4.1V and a sample rate of 500MHz, this converter offers exceptional performance. Trust in Texas Instruments to provide you with the value and benefits you need for your next project.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

Higher maximum analog output voltage allows for greater versatility and compatibility with a wide range of external devices.

No. of Bits: 16

Having 16 bits ensures high resolution and accuracy in the conversion process.

Sample Rate: 500 MHz

High sample rate enables fast and precise conversion of digital signals to analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the converter.

Maximum Operating Temperature: 85 °C

Wide maximum operating temperature range ensures reliability and stability in various environmental conditions.

Technical Specifications

Digital-to-Analog Converters DAC5687IPZP attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10.4 ns

Sample Rate:

500 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Power Supplies:

1.8,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

100

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.551 in (14 mm)

Length:

0.551 in (14 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Trade Compliance

DAC5687IPZP Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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