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DAC5652IPFBG4

Texas Instruments

DAC5652IPFBG4 by Texas Instruments

DAC5652IPFBG4 by Texas Instruments is a 10-bit D/A converter with max analog output voltage of 1.25V and linearity error of 0.0977%. It operates at industrial temperature range, ideal for applications requiring precise analog signal generation in compact spaces.

Median Price

$17.012

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$13.610

1k+ parts

$12.180

10k+ parts

$11.460

540

-

$13.610

$12.180

$11.460

DigiKey

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$17.910

1k+ parts

-

10k+ parts

-

540

-

$17.910

-

-

Verical

USA . 540 parts In-Stock

1+ parts

-

100+ parts

$17.012

1k+ parts

$15.225

10k+ parts

$14.325

540

-

$17.012

$15.225

$14.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,697 parts In-Stock

1+ parts

$10.536

100+ parts

-

1k+ parts

-

10k+ parts

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1,697

$10.536

-

-

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Vyrian

USA . 3,394 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,394

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DigiKey Marketplace

USA . 764 parts In-Stock

1+ parts

-

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-

1k+ parts

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764

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,270 parts In-Stock

1+ parts

$9.653

100+ parts

-

1k+ parts

$10.242

10k+ parts

-

2,270

$9.653

-

$10.242

-

Corphita

USA . 790 parts In-Stock

1+ parts

$9.981

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$9.981

-

-

-

DigiPath Technology Company

USA . 456 parts In-Stock

1+ parts

$10.629

100+ parts

$9.779

1k+ parts

-

10k+ parts

-

456

$10.629

$9.779

-

-

ChromeModa Solutions

Germany . 4,428 parts In-Stock

1+ parts

$10.846

100+ parts

$8.894

1k+ parts

-

10k+ parts

-

4,428

$10.846

$8.894

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-

IDEA Electronic Components Group

UK . 194 parts In-Stock

1+ parts

$10.846

100+ parts

$10.304

1k+ parts

$9.761

10k+ parts

-

194

$10.846

$10.304

$9.761

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Component Stockers USA

USA . 1,283 parts In-Stock

1+ parts

$11.420

100+ parts

$10.730

1k+ parts

-

10k+ parts

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1,283

$11.420

$10.730

-

-

Authorized Procurement Solutions

USA . 123,474 parts In-Stock

1+ parts

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100+ parts

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123,474

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Glotronic Ltd.

UK . 3,790 parts In-Stock

1+ parts

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100+ parts

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3,790

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Northwest PG Solutions

USA . 951 parts In-Stock

1+ parts

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951

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Native Components

USA . 443 parts In-Stock

1+ parts

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443

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Overview

Experience unmatched precision and reliability with the DAC5652IPFBG4 from Texas Instruments, a leading manufacturer in digital-to-analog converters. This innovative product delivers exceptional performance in a wide range of applications, offering customers unparalleled value and benefits. Whether you're looking to enhance audio quality, improve signal processing, or optimize power efficiency, the DAC5652IPFBG4 is the ideal solution for your needs. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations and sets new standards in the industry.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1.25 V

High maximum analog output voltage allows for a wide range of output options and flexibility in signal processing.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection for the internal components.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards and reduces assembly time.

No. of Functions: 2

Having two functions in one device increases functionality and saves space on the circuit board.

Package Shape: SQUARE

Square package shape ensures efficient use of space and easy placement on the circuit board.

No. of Bits: 10

Having more bits allows for higher resolution and accuracy in signal conversion.

Maximum Linearity Error (EL): 0.0977 %

Low maximum linearity error ensures accurate and precise analog output.

Power Supplies (V): 3.3

Operating at 3.3V makes it compatible with standard power supplies and simplifies integration into existing systems.

No. of Terminals: 48

Having a high number of terminals allows for multiple connections and ensures signal integrity.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The package style provides a compact design with efficient heat dissipation and easy installation.

Nominal Settling Time (tstl): 0.02 us

Low settling time ensures quick response and minimal delay in signal processing.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides corrosion resistance and ensures long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for stable connections and reduces signal interference.

Maximum Seated Height: 1.2 mm

Low maximum seated height ensures compatibility with compact designs and reduces overall device profile.

Width: 7 mm

Compact width allows for easy placement on the circuit board and efficient use of space.

Maximum Time At Peak Reflow Temperature (s): 30

High maximum time at peak reflow temperature ensures reliable soldering and proper assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for efficient soldering and secure connections.

Minimum Analog Output Voltage: -1 V

Having a minimum analog output voltage of -1V allows for bipolar signal processing and increased versatility.

Length: 7 mm

Compact length ensures efficient use of space on the circuit board and easy integration into designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: GULL WING

Gull wing terminal form provides secure connections and easy soldering during assembly.

Input Format: PARALLEL, WORD

Supports parallel input format for efficient data transfer and word input format for simplified operation.

Converter Type: D/A CONVERTER

Digital-to-analog converter type ensures accurate conversion of digital signals to analog output.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V ensures compatibility with standard power sources.

Terminal Pitch: 0.5 mm

Compact terminal pitch allows for efficient placement on the circuit board and secure connections.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for a wide range of environmental conditions.

Input Bit Code: OFFSET BINARY

Supports offset binary input bit code for accurate digital-to-analog conversion and signal processing.

Technical Specifications

Digital-to-Analog Converters DAC5652IPFBG4 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Maximum Linearity Error (EL):

0.0977 %

Nominal Settling Time (tstl):

20 ns

No. of Bits:

10

No. of Functions:

2

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

-1 V

Maximum Analog Output Voltage:

1.25 V

Power Supplies:

3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

2

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Trade Compliance

DAC5652IPFBG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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