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DAC3282IRGZR

Texas Instruments

DAC3282IRGZR by Texas Instruments

DAC3282IRGZR by Texas Instruments is a 16-bit D/A converter with 625 MHz sample rate. It operates at industrial temperature grade (-40 to 85 °C) and supports input formats like parallel and word. With a max analog output voltage of 4.1 V, it is ideal for applications requiring high-speed digital-to-analog conversion in various industries.

Median Price

$36.953

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 13,627 parts In-Stock

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$36.953

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$32.847

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$24.152

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$36.953

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Digiode

USA . 2,734 parts In-Stock

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$35.105

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Vyrian

USA . 7,329 parts In-Stock

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Infinite Electronics LLP

India . 50 parts In-Stock

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Native Components

USA . 84 parts In-Stock

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$0.637

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84

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Northwest PG Solutions

USA . 1,174 parts In-Stock

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$0.701

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Parana Technologies

USA . 1,190 parts In-Stock

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$5.897

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$6.682

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$5.897

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$6.682

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DigiPath Technology Company

USA . 1,202 parts In-Stock

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$6.493

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$5.974

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$6.493

$5.974

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ChromeModa Solutions

Germany . 5,380 parts In-Stock

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$6.626

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$5.433

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$6.626

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IDEA Electronic Components Group

UK . 416 parts In-Stock

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$6.626

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$5.963

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416

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AZTECH Wire

Italy . 550 parts In-Stock

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$15.710

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Corphita

USA . 4,201 parts In-Stock

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Lixinc

USA . 19,536 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,744 parts In-Stock

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Assy Fe

Spain . 3,995 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,829 parts In-Stock

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Kepictronics

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Overview

Experience top-notch quality and precision with the DAC3282IRGZR from Texas Instruments, a leading manufacturer known for cutting-edge technology. This Digital-to-Analog Converter offers unparalleled performance and reliability, making it ideal for a wide range of applications. From industrial automation to communications systems, this product delivers exceptional value and benefits to customers, ensuring high accuracy and efficiency in every use. Trust Texas Instruments to provide you with the best-in-class solutions for your digital-to-analog conversion needs.

Feature Benefit Bullets

Maximum Analog Output Voltage: 4.1 V

Provides a high maximum output voltage for precise analog signal generation.

Package Body Material: PLASTIC/EPOXY

Offers durability and protection for the internal components of the converter.

No. of Bits: 16

Provides high resolution for accurate digital-to-analog conversion.

Maximum Operating Temperature: 85 °C

Can operate reliably in a wide range of temperatures, suitable for various environments.

Sample Rate: 625 MHz

High sample rate allows for fast and efficient conversion of digital signals to analog.

Technical Specifications

Digital-to-Analog Converters DAC3282IRGZR attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Technology:

CMOS

Sub-Category:

Other Converters

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary, 2's Complement Binary

Nominal Settling Time (tstl):

10.4 ns

Sample Rate:

625 MHz

No. of Bits:

16

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

3.3 V

Minimum Analog Output Voltage:

2.5 V

Maximum Analog Output Voltage:

4.1 V

Power Supplies:

1.8,3.3 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

48

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.276 in (7 mm)

Length:

0.276 in (7 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Standards and Codes

Qualified:

No

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Trade Compliance

DAC3282IRGZR Converters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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