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DAC3171IRGC25

Texas Instruments

DAC3171IRGC25 by Texas Instruments

DAC3171IRGC25 by Texas Instruments is a 14-bit D/A converter with max analog output voltage of 1V. It operates in industrial temperature range (-40 to 85°C) and has a nominal settling time of 0.011us. Ideal for applications requiring precise analog signal generation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,580 parts In-Stock

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5,580

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Digiode

USA . 2,586 parts In-Stock

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2,586

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Holdelec - ElecDif-Pro

France . 10 parts In-Stock

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10

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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10

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 238 parts In-Stock

1+ parts

$5.036

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238

$5.036

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AZTECH Wire

Italy . 584 parts In-Stock

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$6.583

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584

$6.583

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One Stop Electronics

USA . 437 parts In-Stock

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$11.000

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437

$11.000

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$19.102

100+ parts

$17.383

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$15.664

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3,000

$19.102

$17.383

$15.664

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Ampacity Inc.

Singapore . 1,052 parts In-Stock

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$20.000

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1,052

$20.000

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Parana Technologies

USA . 926 parts In-Stock

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$23.581

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$24.213

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926

$23.581

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$24.213

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ChromeModa Solutions

Germany . 3,862 parts In-Stock

1+ parts

$26.495

100+ parts

$21.726

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3,862

$26.495

$21.726

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IDEA Electronic Components Group

UK . 1,274 parts In-Stock

1+ parts

$26.495

100+ parts

$25.170

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$23.846

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1,274

$26.495

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$23.846

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Corphita

USA . 2,826 parts In-Stock

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2,826

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Bastille Electronics

Australia . 650 parts In-Stock

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650

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DigiPath Technology Company

USA . 413 parts In-Stock

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$23.888

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413

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$23.888

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Overview

Experience unmatched precision and reliability with the Texas Instruments DAC3171IRGC25 Digital-to-Analog Converter. Crafted by a trusted industry leader, this product delivers unparalleled performance in a wide range of applications. Unlock new possibilities and enhance your projects with its advanced features and cutting-edge technology. Trust in Texas Instruments to provide you with the quality and value you need to succeed. Elevate your work to the next level with the DAC3171IRGC25 today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1 V

Provides a high maximum analog output voltage, enabling precise and accurate analog signal conversion.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring the longevity of the product.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

No. of Bits: 14

With 14 bits resolution, this D/A converter can provide detailed and precise conversion of digital signals to analog output.

Nominal Settling Time (tstl): 0.011 us

The fast settling time of 0.011 us ensures quick response and accurate output, suitable for real-time applications.

Maximum Operating Temperature: 85 °C

This D/A converter can operate at high temperatures, making it suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperatures, providing versatility in various environmental conditions.

Nominal Supply Voltage: 1.8 V

Operates at a nominal supply voltage of 1.8 V, suitable for low power consumption applications.

Technical Specifications

Digital-to-Analog Converters DAC3171IRGC25 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Nominal Settling Time (tstl):

11 ns

No. of Bits:

14

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

1 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC3171IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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