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DAC3161IRGC25

Texas Instruments

DAC3161IRGC25 by Texas Instruments

DAC3161IRGC25 by Texas Instruments is a 12-bit D/A converter with max analog output voltage of 1V. It operates in industrial temperature range (-40 to 85°C) and has a settling time of 0.011us. Ideal for applications requiring precise analog signal generation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,221 parts In-Stock

1+ parts

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8,221

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Digiode

USA . 4,845 parts In-Stock

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4,845

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Distributors (Availability)

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Native Components

USA . 717 parts In-Stock

1+ parts

$1.457

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717

$1.457

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Northwest PG Solutions

USA . 708 parts In-Stock

1+ parts

$1.603

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-

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708

$1.603

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AZTECH Wire

Italy . 555 parts In-Stock

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$14.650

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555

$14.650

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Parana Technologies

USA . 725 parts In-Stock

1+ parts

$19.559

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$19.560

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725

$19.559

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$19.560

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DigiPath Technology Company

USA . 84 parts In-Stock

1+ parts

$21.536

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84

$21.536

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ChromeModa Solutions

Germany . 2,885 parts In-Stock

1+ parts

$21.976

100+ parts

$18.020

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2,885

$21.976

$18.020

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IDEA Electronic Components Group

UK . 1,247 parts In-Stock

1+ parts

$21.976

100+ parts

$20.877

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$19.778

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1,247

$21.976

$20.877

$19.778

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One Stop Electronics

USA . 723 parts In-Stock

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$35.000

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723

$35.000

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Corphita

USA . 496 parts In-Stock

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496

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Overview

Enhance your electronic designs with the high-quality DAC3161IRGC25 by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-of-the-line Digital-to-Analog Converters that offer precision and reliability. Ideal for a wide range of applications, this product provides customers with unparalleled value, benefits, and advantages. Experience superior performance and efficiency with the DAC3161IRGC25, setting new standards in the industry. Elevate your projects with Texas Instruments today.

Feature Benefit Bullets

Maximum Analog Output Voltage: 1 V

Provides a high maximum analog output voltage, allowing for a wide range of output signals to be generated.

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the components inside.

Surface Mount: YES

Being surface mountable makes installation and integration of this product easier and more efficient.

No. of Bits: 12

With 12 bits, this digital-to-analog converter offers high resolution and accuracy in converting digital signals to analog.

Nominal Settling Time (tstl): 0.011 us

Provides fast settling time, ensuring quick response to input changes and maintaining stability in output signals.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures, suitable for industrial applications with demanding environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish enhances conductivity and reliability of connections.

Width: 9 mm

Compact width size allows for space-efficient placement and integration in electronic systems.

Input Format: PARALLEL, WORD

Supports parallel and word input formats, providing flexibility in interfacing with different types of digital systems.

Nominal Supply Voltage: 1.8 V

Works efficiently at a nominal supply voltage of 1.8 V, suitable for low power consumption applications.

Technical Specifications

Digital-to-Analog Converters DAC3161IRGC25 attributes and parameters. Explore more Digital-to-Analog Converters devices from Texas Instruments

Converter Specifications

Input Format:

Parallel, Word

Input Bit Code:

Offset Binary

Nominal Settling Time (tstl):

11 ns

No. of Bits:

12

No. of Functions:

1

Electrical Specifications

Nominal Supply Voltage:

1.8 V

Minimum Analog Output Voltage:

-.5 V

Maximum Analog Output Voltage:

1 V

Operating Conditions

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Moisture Sensitivity Level (MSL):

3

Form Factor

No. of Terminals:

64

Terminal Form:

Terminal Position:

Quad

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Finish:

Nickel Palladium Gold

Surface Mount:

Yes

Width:

0.354 in (9 mm)

Length:

0.354 in (9 mm)

Maximum Seated Height:

0.039 in (1 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Shape:

Package Style:

Chip Carrier, Heat Sink/Slug, Very Thin Profile

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Trade Compliance

DAC3161IRGC25 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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