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CY74FCT652CTSOCE4

Texas Instruments

CY74FCT652CTSOCE4 by Texas Instruments

CY74FCT652CTSOCE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.4 ns at 5V, featuring a small outline package and dual terminal position. It operates in industrial temperature range (-40 to 85°C) and supports bidirectional count direction, making it ideal for high-speed data transmission applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,930 parts In-Stock

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Digiode

USA . 64 parts In-Stock

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64

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Distributors (Availability)

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Native Components

USA . 730 parts In-Stock

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$1.584

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730

$1.584

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Northwest PG Solutions

USA . 1,962 parts In-Stock

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$1.743

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$1.743

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Andel Nordic

Denmark . 209 parts In-Stock

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$9.567

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$9.184

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$9.184

209

$9.567

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$9.184

One Stop Electronics

USA . 1,600 parts In-Stock

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$18.000

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$18.000

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AZTECH Wire

Italy . 599 parts In-Stock

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$18.206

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599

$18.206

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Parana Technologies

USA . 2,144 parts In-Stock

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$25.486

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$26.109

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2,144

$25.486

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$26.109

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DigiPath Technology Company

USA . 907 parts In-Stock

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$28.063

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$25.818

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907

$28.063

$25.818

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ChromeModa Solutions

Germany . 418 parts In-Stock

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$28.636

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$23.482

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418

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IDEA Electronic Components Group

UK . 90 parts In-Stock

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$28.636

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$27.204

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$25.772

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90

$28.636

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Corphita

USA . 1,333 parts In-Stock

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Microchip USA

USA . 219 parts In-Stock

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Overview

Unlock the power of seamless data transmission with the CY74FCT652CTSOCE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. Ideal for Bus Driver & Transceivers applications, this product boasts a fast propagation delay of 5.4 ns and a true 3-STATE output characteristic. With a compact package style and dual terminal position, the CY74FCT652CTSOCE4 offers exceptional value and performance. Trust Texas Instruments to provide cutting-edge technology that meets your industrial needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product durable and lightweight, making it easy to handle and install.

Propagation Delay At Nominal Supply: 5.4 ns

With a low propagation delay, this product ensures fast and efficient signal transmission, ideal for high-speed communication applications.

Surface Mount: YES

The surface mount feature allows for easy and space-saving installation on PCBs, making it convenient for integration into various electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V, this product is compatible with common power supplies and ensures reliable performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for diverse applications and customization.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this product can withstand a wide range of temperatures, ensuring reliable operation in challenging conditions.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption and high noise immunity, making it efficient and reliable for various applications.

Technical Specifications

Bus Driver & Transceivers CY74FCT652CTSOCE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

5.4 ns

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT652CTSOCE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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