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CY74FCT573CTQCTG4

Texas Instruments

CY74FCT573CTQCTG4 by Texas Instruments

CY74FCT573CTQCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.7 ns, ideal for industrial applications. It operates at a nominal voltage of 5V and features a max operating temperature of 85°C. With surface mount capability and dual terminal position, it offers efficient bidirectional control in compact dimensions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,510 parts In-Stock

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Vyrian

USA . 3,801 parts In-Stock

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Andel Nordic

Denmark . 769 parts In-Stock

1+ parts

$2.409

100+ parts

-

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$2.312

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$2.312

769

$2.409

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$2.312

$2.312

AZTECH Wire

Italy . 874 parts In-Stock

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$17.443

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874

$17.443

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Parana Technologies

USA . 2,278 parts In-Stock

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$20.891

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$21.082

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$20.891

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$21.082

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IDEA Electronic Components Group

UK . 844 parts In-Stock

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$23.473

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$22.299

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$21.126

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844

$23.473

$22.299

$21.126

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ChromeModa Solutions

Germany . 599 parts In-Stock

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$23.473

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$19.248

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599

$23.473

$19.248

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One Stop Electronics

USA . 1,487 parts In-Stock

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$40.000

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Component Stockers USA

USA . 674 parts In-Stock

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$99.990

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674

$99.990

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Microchip USA

USA . 2,226 parts In-Stock

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Native Components

USA . 668 parts In-Stock

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Corphita

USA . 501 parts In-Stock

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DigiPath Technology Company

USA . 403 parts In-Stock

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$21.163

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Northwest PG Solutions

USA . 237 parts In-Stock

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Overview

Enhance your electronic projects with the CY74FCT573CTQCTG4 by Texas Instruments, a high-quality Bus Driver & Transceiver that offers reliable performance and efficiency. Manufactured by the renowned Texas Instruments, this product is perfect for a wide range of applications. With its advanced technology and durable design, this component ensures seamless data transmission while providing a cost-effective solution for your needs. Upgrade your projects with the CY74FCT573CTQCTG4 and experience the value and benefits it brings to your creations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications.

Propagation Delay At Nominal Supply: 4.7 ns

The low propagation delay ensures fast signal transmission, making the product suitable for high-speed communication applications.

Surface Mount: YES

Being surface mountable makes the product easy to install and saves space on the PCB, enhancing overall design flexibility.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common standard in many electronic systems, making the product compatible with a wide range of applications.

No. of Bits: 8

Having 8 bits allows for a higher data resolution and accuracy in signal processing, making the product suitable for precise control applications.

Output Characteristics: 3-STATE

The 3-STATE output allows for multiple devices to share a common bus, providing flexibility and enabling efficient communication in a multi-device system.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the product suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in noisy environments.

Technical Specifications

Bus Driver & Transceivers CY74FCT573CTQCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

2

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.2 mA

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CY74FCT573CTQCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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