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CY74FCT541CTSOCTE4

Texas Instruments

CY74FCT541CTSOCTE4 by Texas Instruments

CY74FCT541CTSOCTE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.1 ns at 5V, suitable for industrial applications. It features a 3-STATE output, operates b/w -40 to 85°C, and has a max power supply current of 0.2 mA. This CMOS technology device comes in a small outline package with dual terminals and GULL WING form factor.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,209 parts In-Stock

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Digiode

USA . 3,394 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 461 parts In-Stock

1+ parts

$0.081

100+ parts

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$0.078

461

$0.081

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$0.078

Northwest PG Solutions

USA . 2,335 parts In-Stock

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$0.089

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$0.078

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$0.089

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$0.078

AZTECH Wire

Italy . 217 parts In-Stock

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$9.089

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Parana Technologies

USA . 669 parts In-Stock

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$9.113

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$9.766

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669

$9.113

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$9.766

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DigiPath Technology Company

USA . 1,632 parts In-Stock

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$10.034

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$10.034

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ChromeModa Solutions

Germany . 6,937 parts In-Stock

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$10.239

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$8.396

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IDEA Electronic Components Group

UK . 473 parts In-Stock

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$10.239

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$9.727

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$9.215

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Andel Nordic

Denmark . 276 parts In-Stock

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$10.898

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$10.462

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276

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$10.462

One Stop Electronics

USA . 654 parts In-Stock

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$55.000

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Component Stockers USA

USA . 237 parts In-Stock

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$99.990

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Corphita

USA . 2,832 parts In-Stock

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Microchip USA

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Overview

Unlock seamless data transmission with the CY74FCT541CTSOCTE4 by Texas Instruments. Crafted with precision and reliability, this bus driver & transceiver ensures optimal performance in various applications. From industrial automation to communication systems, this product offers unparalleled value with its 3-state output characteristics, true output polarity, and low propagation delay of 4.1 ns. Trust in Texas Instruments for cutting-edge technology that delivers efficiency and accuracy in every operation. Experience the difference with the CY74FCT541CTSOCTE4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for use in portable or rugged applications.

Propagation Delay At Nominal Supply: 4.1 ns

The low propagation delay ensures fast and efficient signal transmission within the bus driver, reducing latency and improving overall performance.

Surface Mount: YES

The surface mount capability allows for easy and convenient PCB assembly, saving time and effort during manufacturing.

Nominal Supply Voltage: 5V

The 5V nominal supply voltage is a common and standard voltage level, ensuring compatibility with a wide range of systems and components.

Output Characteristics: 3-STATE

The 3-state output allows the bus driver to control the bus lines effectively, enabling high-speed data transmission while minimizing signal interference.

Technical Specifications

Bus Driver & Transceivers CY74FCT541CTSOCTE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

FCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.2 mA

Propagation Delay At Nominal Supply:

4.1 ns

Propagation Delay (tpd):

4.1 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT541CTSOCTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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