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CY74FCT373CTSOCE4

Texas Instruments

CY74FCT373CTSOCE4 by Texas Instruments

CY74FCT373CTSOCE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.7 ns at 5V, suitable for industrial applications. It features a 3-STATE output and operates within a temperature range of -40 to 85°C, making it ideal for high-speed data transmission in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,091 parts In-Stock

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Digiode

USA . 1,139 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,583 parts In-Stock

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$4.000

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$4.000

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Andel Nordic

Denmark . 161 parts In-Stock

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$6.638

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$6.373

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$6.373

161

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$6.373

AZTECH Wire

Italy . 723 parts In-Stock

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$6.649

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723

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Parana Technologies

USA . 586 parts In-Stock

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$12.588

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$1,169.002

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$11.329

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586

$12.588

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DigiPath Technology Company

USA . 1,563 parts In-Stock

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$13.861

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IDEA Electronic Components Group

UK . 2,097 parts In-Stock

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$14.144

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$13.437

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$12.730

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ChromeModa Solutions

Germany . 275 parts In-Stock

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$14.144

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$11.598

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Microchip USA

USA . 4,621 parts In-Stock

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Northwest PG Solutions

USA . 2,161 parts In-Stock

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Corphita

USA . 2,038 parts In-Stock

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Native Components

USA . 560 parts In-Stock

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Overview

Enhance your electronic designs with the CY74FCT373CTSOCE4 by Texas Instruments, a high-quality Bus Driver & Transceiver that guarantees reliable performance. With Texas Instruments' renowned reputation for excellence in semiconductor manufacturing, this product offers unmatched value and benefits. Ideal for applications requiring efficient data transmission, this 8-bit device boasts a low propagation delay of 4.7ns, ensuring fast and accurate signal processing. Trust in Texas Instruments to deliver cutting-edge technology that meets your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 4.7 ns

Low propagation delay ensures fast transmission of signals, making this product suitable for high-speed applications.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

No. of Bits: 8

8 bits provide enough data transmission capacity for a variety of applications, making this product versatile.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, making it compatible with a wide range of systems and circuits.

Maximum Operating Temperature: 85 °C

Withstands high temperatures, making it suitable for industrial environments where heat resistance is crucial.

Output Polarity: TRUE

Output polarity is true, ensuring accurate signal transmission without any inversions, providing reliability in data communication.

Technical Specifications

Bus Driver & Transceivers CY74FCT373CTSOCE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

4.7 ns

Propagation Delay (tpd):

5.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

CY74FCT373CTSOCE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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