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CY74FCT2574TSOCTG4

Texas Instruments

CY74FCT2574TSOCTG4 by Texas Instruments

CY74FCT2574TSOCTG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10ns at 5V. It features a 3-STATE output with series resistor, suitable for industrial applications requiring fast signal transmission. This CMOS technology device comes in a small outline package, making it ideal for compact designs with dual terminal positions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,352 parts In-Stock

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Digiode

USA . 3,247 parts In-Stock

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3,247

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Distributors (Availability)

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Native Components

USA . 839 parts In-Stock

1+ parts

$0.544

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839

$0.544

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Northwest PG Solutions

USA . 1,514 parts In-Stock

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$0.598

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$0.598

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Andel Nordic

Denmark . 2,336 parts In-Stock

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$3.194

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$3.066

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$3.066

2,336

$3.194

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$3.066

$3.066

Parana Technologies

USA . 1,100 parts In-Stock

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$10.887

100+ parts

$1,011.057

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$9.799

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1,100

$10.887

$1,011.057

$9.799

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DigiPath Technology Company

USA . 375 parts In-Stock

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$11.988

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375

$11.988

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ChromeModa Solutions

Germany . 3,718 parts In-Stock

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$12.233

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$10.031

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$12.233

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IDEA Electronic Components Group

UK . 11 parts In-Stock

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$12.233

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$11.621

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$11.010

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11

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$11.010

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AZTECH Wire

Italy . 720 parts In-Stock

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$15.787

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One Stop Electronics

USA . 1,565 parts In-Stock

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$27.000

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Component Stockers USA

USA . 640 parts In-Stock

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$99.990

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Corphita

USA . 1,307 parts In-Stock

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Microchip USA

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Overview

Upgrade your electronic designs with the CY74FCT2574TSOCTG4 by Texas Instruments, a top-quality Bus Driver & Transceiver. Manufactured by industry leader Texas Instruments, this product offers reliable performance and versatility for various applications. With a low propagation delay of 10 ns, 3-state output characteristics, and a wide operating temperature range, this component delivers exceptional value to customers seeking high-speed data transmission. Trust Texas Instruments for cutting-edge technology and superior products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package durable and resistant to external factors, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 10 ns

Low propagation delay time ensures fast data transmission and efficient performance.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and making installation simpler.

Nominal Supply Voltage / Vsup (V): 5

Operating at a commonly used supply voltage of 5V makes it compatible with various systems and applications.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

3-state output with a series resistor provides flexibility and control over the output signal, allowing for better signal integrity.

Minimum Operating Temperature: -40 °C

Wide operating temperature range allows the product to function reliably in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Bus Driver & Transceivers CY74FCT2574TSOCTG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT2574TSOCTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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