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CY74FCT2574TSOCG4

Texas Instruments

CY74FCT2574TSOCG4 by Texas Instruments

CY74FCT2574TSOCG4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 10ns at 5V. It features a small outline package, operates in industrial temperature range (-40 to 85 °C), and has true output polarity. Ideal for applications requiring fast signal transmission and precise timing control.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,749 parts In-Stock

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6,749

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Digiode

USA . 3,344 parts In-Stock

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3,344

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Distributors (Availability)

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Andel Nordic

Denmark . 623 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

$1.689

10k+ parts

$1.689

623

$1.760

-

$1.689

$1.689

Parana Technologies

USA . 575 parts In-Stock

1+ parts

$15.541

100+ parts

-

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$15.916

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575

$15.541

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$15.916

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ChromeModa Solutions

Germany . 6,874 parts In-Stock

1+ parts

$17.462

100+ parts

$14.319

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$17.462

$14.319

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IDEA Electronic Components Group

UK . 1,316 parts In-Stock

1+ parts

$17.462

100+ parts

$16.589

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$15.716

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1,316

$17.462

$16.589

$15.716

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AZTECH Wire

Italy . 533 parts In-Stock

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$18.646

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533

$18.646

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One Stop Electronics

USA . 1,378 parts In-Stock

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$59.000

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1,378

$59.000

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Component Stockers USA

USA . 481 parts In-Stock

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$99.990

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481

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 26,893 parts In-Stock

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Microchip USA

USA . 4,917 parts In-Stock

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Corphita

USA . 4,154 parts In-Stock

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4,154

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DigiPath Technology Company

USA . 1,627 parts In-Stock

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$15.744

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$15.744

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Native Components

USA . 681 parts In-Stock

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Northwest PG Solutions

USA . 377 parts In-Stock

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377

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Overview

Experience seamless data transmission and reliable performance with the CY74FCT2574TSOCG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality bus drivers & transceivers that are essential for various applications. With a compact design and efficient power management, this product ensures fast propagation delay and minimal signal distortion. Trust Texas Instruments to provide you with the tools you need for your projects, offering unmatched value and benefits to customers seeking superior performance and reliability in their electronic components.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 10 ns

The low propagation delay ensures quick transmission of signals, making this product efficient for bus driver and transceiver applications.

Surface Mount: YES

Being surface mountable allows for easy and compact installation on circuit boards, saving space and simplifying assembly.

No. of Bits: 8

The 8-bit configuration provides sufficient data transfer capabilities for most bus driver and transceiver requirements.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with common power sources and systems.

Load Capacitance (CL): 50 pF

The specified load capacitance ensures stable performance and efficient signal transmission in bus driver and transceiver applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes this product suitable for use in industrial environments where temperatures can vary.

Technology: CMOS

The use of CMOS technology ensures low power consumption and reliable operation, making this product energy-efficient and dependable.

Technical Specifications

Bus Driver & Transceivers CY74FCT2574TSOCG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

FCT

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CY74FCT2574TSOCG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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