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CDCU877GQLT

Texas Instruments

CDCU877GQLT by Texas Instruments

The Texas Instruments CDCU877GQLT clock driver features 52 terminals, operates at a supply voltage of 1.8V, and offers a max output current of 9A. Ideal for industrial applications requiring differential input conditioning and a CMOS technology, this device has a compact rectangular package with very thin profile and fine pitch grid array style.

Median Price

$6.275

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

1+ parts

$11.570

100+ parts

$8.650

1k+ parts

-

10k+ parts

-

1

$11.570

$8.650

-

-

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$5.020

1k+ parts

$4.490

10k+ parts

$4.220

9,000

-

$5.020

$4.490

$4.220

Verical

USA . 8,250 parts In-Stock

1+ parts

-

100+ parts

$6.275

1k+ parts

$5.612

10k+ parts

$5.275

8,250

-

$6.275

$5.612

$5.275

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,989 parts In-Stock

1+ parts

$5.292

100+ parts

-

1k+ parts

-

10k+ parts

-

4,989

$5.292

-

-

-

DigiKey Marketplace

USA . 9,009 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,009

-

-

-

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Vyrian

USA . 6,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,749

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5

-

-

-

-

Zilex Electronics Inc.

Canada . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 8,819 parts In-Stock

1+ parts

$4.730

100+ parts

-

1k+ parts

-

10k+ parts

-

8,819

$4.730

-

-

-

Corphita

USA . 2,339 parts In-Stock

1+ parts

$5.013

100+ parts

-

1k+ parts

-

10k+ parts

-

2,339

$5.013

-

-

-

Andel Nordic

Denmark . 2,228 parts In-Stock

1+ parts

$6.209

100+ parts

-

1k+ parts

$5.960

10k+ parts

$5.960

2,228

$6.209

-

$5.960

$5.960

Parana Technologies

USA . 440 parts In-Stock

1+ parts

$13.329

100+ parts

$1,237.766

1k+ parts

$11.996

10k+ parts

-

440

$13.329

$1,237.766

$11.996

-

DigiPath Technology Company

USA . 2,058 parts In-Stock

1+ parts

$14.676

100+ parts

-

1k+ parts

-

10k+ parts

-

2,058

$14.676

-

-

-

ChromeModa Solutions

Germany . 2,496 parts In-Stock

1+ parts

$14.976

100+ parts

$12.280

1k+ parts

-

10k+ parts

-

2,496

$14.976

$12.280

-

-

IDEA Electronic Components Group

UK . 441 parts In-Stock

1+ parts

$14.976

100+ parts

$14.227

1k+ parts

$13.478

10k+ parts

-

441

$14.976

$14.227

$13.478

-

Northwest PG Solutions

USA . 2,138 parts In-Stock

1+ parts

-

100+ parts

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2,138

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Native Components

USA . 552 parts In-Stock

1+ parts

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552

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Microchip USA

USA . 304 parts In-Stock

1+ parts

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100+ parts

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304

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Overview

Enhance your electronic designs with the CDCU877GQLT clock driver by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products like this one that offer precision and reliability. Ideal for various applications in clock drivers and buffers, this product provides customers with exceptional value and performance. Upgrade your projects with the CDCU877GQLT and experience the advantages of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during manufacturing.

Nominal Supply Voltage / Vsup (V): 1.8

Works efficiently at a commonly used supply voltage, ensuring compatibility with a wide range of systems.

Maximum I (ol): 9 Amp

Capable of handling high output currents, making it suitable for driving multiple components in a circuit.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments, expanding its range of applications.

Output Characteristics: 3-STATE

Supports 3-state logic, allowing for flexible control of output signals and improved system performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the clock driver.

Minimum fmax: 340 MHz

High maximum frequency allows for fast data processing and precise timing, ideal for clock distribution applications.

Technical Specifications

Clock Drivers & Buffers CDCU877GQLT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

877

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PBGA-B52

JESD-609 Code:

e0

Length:

7 mm

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

52

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA52,6X10,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.035 ns

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

4.5 mm

Minimum fmax:

340 MHz

Trade Compliance

CDCU877GQLT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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