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CDCLVP111HFG/EM

Texas Instruments

CDCLVP111HFG/EM by Texas Instruments

CDCLVP111HFG/EM clock driver by Texas Instruments features a 3.3V supply voltage, 0.355ns propagation delay, and 20 true outputs. With a package style of flatpack and heat sink/slug, it is ideal for applications requiring high-speed clock distribution in electronic systems. The differential mux input conditioning and 3500MHz min fmax make it suitable for demanding signal processing tasks.

Median Price

$1,153.677

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,039 parts In-Stock

1+ parts

$1,153.677

100+ parts

$1,030.069

1k+ parts

-

10k+ parts

-

2,039

$1,153.677

$1,030.069

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1,009.872

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1,009.872

-

-

-

Digiode

USA . 3,537 parts In-Stock

1+ parts

$1,095.993

100+ parts

-

1k+ parts

-

10k+ parts

-

3,537

$1,095.993

-

-

-

Vyrian

USA . 8,755 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,755

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,936 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

$1.469

10k+ parts

$1.469

5,936

$1.530

-

$1.469

$1.469

Parana Technologies

USA . 1,145 parts In-Stock

1+ parts

$16.271

100+ parts

-

1k+ parts

$16.580

10k+ parts

-

1,145

$16.271

-

$16.580

-

DigiPath Technology Company

USA . 1,260 parts In-Stock

1+ parts

$17.916

100+ parts

-

1k+ parts

-

10k+ parts

-

1,260

$17.916

-

-

-

ChromeModa Solutions

Germany . 6,652 parts In-Stock

1+ parts

$18.282

100+ parts

$14.991

1k+ parts

-

10k+ parts

-

6,652

$18.282

$14.991

-

-

IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$18.282

100+ parts

$17.368

1k+ parts

$16.454

10k+ parts

-

2,044

$18.282

$17.368

$16.454

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AZTECH Wire

Italy . 1,001 parts In-Stock

1+ parts

$21.810

100+ parts

-

1k+ parts

-

10k+ parts

-

1,001

$21.810

-

-

-

Ampacity Inc.

Singapore . 1,912 parts In-Stock

1+ parts

$980.630

100+ parts

-

1k+ parts

-

10k+ parts

-

1,912

$980.630

-

-

-

Corphita

USA . 2,291 parts In-Stock

1+ parts

$1,038.309

100+ parts

-

1k+ parts

-

10k+ parts

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2,291

$1,038.309

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-

-

Microchip USA

USA . 2,918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,918

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-

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Overview

Unlock precision timing with the CDCLVP111HFG/EM by Texas Instruments. As a leading manufacturer in clock drivers & buffers, Texas Instruments delivers top-notch quality and reliability. This versatile component is perfect for a wide range of applications, offering customers unparalleled value and performance. Say goodbye to timing issues and hello to seamless operation with the CDCLVP111HFG/EM.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Input Conditioning: DIFFERENTIAL MUX

Helps in signal conditioning and noise reduction for improved performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level for efficient operation.

Propagation Delay (tpd): 0.355 ns

Fast signal propagation ensures accurate and timely clocking.

No. of True Outputs: 20

Offers multiple outputs for versatile clock distribution.

Minimum fmax: 3500 MHz

High maximum frequency capability for demanding applications.

Technical Specifications

Clock Drivers & Buffers CDCLVP111HFG/EM attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Additional Features:

IT ALSO HAS SUPPLY VOLTAGE NOM OF 3.3

Family:

CDCLVP

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-CQFP-F36

Length:

9.078 mm

Logic IC Type:

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

36

No. of True Outputs:

20

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, GUARD RING

Peak Reflow Temperature (C):

NOT SPECIFIED

Propagation Delay (tpd):

.355 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

2.224 mm

Maximum Supply Voltage (Vsup):

3.8 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

9.078 mm

Minimum fmax:

3500 MHz

Trade Compliance

CDCLVP111HFG/EM Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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