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CDCLVD110VFG4

Texas Instruments

CDCLVD110VFG4 by Texas Instruments

CDCLVD110VFG4 by Texas Instruments is a clock driver with 3 ns propagation delay at 2.5V, suitable for industrial applications. It features differential mux input conditioning, 10 true outputs, and operates b/w -40 to 85°C. This square-shaped package has a low profile design and is surface mountable.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,401 parts In-Stock

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Digiode

USA . 4,082 parts In-Stock

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4,082

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Distributors (Availability)

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Andel Nordic

Denmark . 5,870 parts In-Stock

1+ parts

$4.010

100+ parts

-

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$3.850

10k+ parts

$3.850

5,870

$4.010

-

$3.850

$3.850

Native Components

USA . 423 parts In-Stock

1+ parts

$5.316

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423

$5.316

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AZTECH Wire

Italy . 507 parts In-Stock

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$14.408

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507

$14.408

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Parana Technologies

USA . 1,202 parts In-Stock

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$17.999

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$18.157

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1,202

$17.999

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$18.157

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DigiPath Technology Company

USA . 2,125 parts In-Stock

1+ parts

$19.820

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$18.234

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2,125

$19.820

$18.234

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$20.224

100+ parts

$19.213

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$18.202

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1,809

$20.224

$19.213

$18.202

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ChromeModa Solutions

Germany . 1,217 parts In-Stock

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$20.224

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$16.584

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$20.224

$16.584

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One Stop Electronics

USA . 1,575 parts In-Stock

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$49.000

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$49.000

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Corphita

USA . 2,796 parts In-Stock

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Microchip USA

USA . 2,033 parts In-Stock

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Northwest PG Solutions

USA . 764 parts In-Stock

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$5.210

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764

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$5.210

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Overview

Enhance your electronic designs with the CDCLVD110VFG4 by Texas Instruments, a top-quality clock driver & buffer that guarantees precision and reliability. Crafted by the industry-leading manufacturer, this product offers unrivaled performance and efficiency for a wide range of applications. With its advanced features and cutting-edge technology, customers can expect seamless operation and optimal results. Upgrade your projects today with the CDCLVD110VFG4 and experience the unparalleled value it brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting use.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures fast signal processing.

Surface Mount: YES

Easy to install and saves space on the PCB.

Input Conditioning: DIFFERENTIAL MUX

Provides flexibility in signal input options.

Nominal Supply Voltage / Vsup (V): 2.5

Optimal supply voltage for efficient operation.

No. of Terminals: 32

Sufficient terminals for connections.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures in industrial environments.

Output Characteristics: 3-STATE

Allows for high impedance output when needed.

Minimum Operating Temperature: -40 °C

Suitable for use in a wide temperature range.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and good electrical conductivity.

Maximum Seated Height: 1.6 mm

Low profile design for space-constrained applications.

Minimum Supply Voltage (Vsup): 2.375 V

Supports low supply voltage operation.

Peak Reflow Temperature °C: 260

Can withstand high temperature during soldering.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with wide temperature range.

Terminal Pitch: 0.8 mm

Fine pitch for compact layout and PCB design.

Technical Specifications

Clock Drivers & Buffers CDCLVD110VFG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

150 MHz

Trade Compliance

CDCLVD110VFG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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