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CDCLVD110AVFR

Texas Instruments

CDCLVD110AVFR by Texas Instruments

CDCLVD110AVFR clock driver by Texas Instruments features a 3 ns propagation delay, 10 true outputs, and operates at a max frequency of 1100 MHz. Ideal for industrial applications requiring differential mux input conditioning and a low profile flatpack package style.

Median Price

$11.410

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,902 parts In-Stock

1+ parts

$9.050

100+ parts

$7.905

1k+ parts

$5.452

10k+ parts

-

3,902

$9.050

$7.905

$5.452

-

DigiKey

USA . 529 parts In-Stock

1+ parts

$13.770

100+ parts

$9.328

1k+ parts

$8.528

10k+ parts

-

529

$13.770

$9.328

$8.528

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,643 parts In-Stock

1+ parts

$8.598

100+ parts

-

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4,643

$8.598

-

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Vyrian

USA . 7,880 parts In-Stock

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7,880

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Chip Stock

USA . 1,088 parts In-Stock

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1,088

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Bristol Electronics

USA . 1,000 parts In-Stock

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1,000

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TME

Poland . 1,000 parts In-Stock

1+ parts

-

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$10.358

10k+ parts

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1,000

-

-

$10.358

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Connector Distribution Corp

USA . 300 parts In-Stock

1+ parts

-

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300

-

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Right Parts Inc.

USA . 300 parts In-Stock

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300

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ACDS - Activité Composants Distribution Service

France . 48 parts In-Stock

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48

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Distributors (Availability)

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Andel Nordic

Denmark . 1,651 parts In-Stock

1+ parts

$5.999

100+ parts

-

1k+ parts

$5.759

10k+ parts

$5.759

1,651

$5.999

-

$5.759

$5.759

Corphita

USA . 1,283 parts In-Stock

1+ parts

$8.145

100+ parts

-

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1,283

$8.145

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Parana Technologies

USA . 1,031 parts In-Stock

1+ parts

$26.697

100+ parts

-

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$27.482

10k+ parts

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1,031

$26.697

-

$27.482

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DigiPath Technology Company

USA . 777 parts In-Stock

1+ parts

$29.397

100+ parts

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777

$29.397

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ChromeModa Solutions

Germany . 2,036 parts In-Stock

1+ parts

$29.997

100+ parts

$24.598

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2,036

$29.997

$24.598

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

1+ parts

$29.997

100+ parts

$28.497

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$26.997

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1,314

$29.997

$28.497

$26.997

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Lixinc

USA . 15,064 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,650 parts In-Stock

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6,650

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Alle Elektronik GmbH

Germany . 4,433 parts In-Stock

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Northwest PG Solutions

USA . 1,591 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Native Components

USA . 944 parts In-Stock

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Kepictronics

USA . 847 parts In-Stock

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Infinite Electronics LLP (Excess)

. 516 parts In-Stock

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Perfect Parts

USA . 403 parts In-Stock

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403

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Cyclops Electronics Ltd (Excess)

UK . 48 parts In-Stock

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Overview

Enhance your electronic designs with the CDCLVD110AVFR clock driver and buffer by Texas Instruments. Crafted with precision and reliability, this product offers seamless integration for a wide range of applications in the field of clock drivers & buffers. Elevate your projects with the superior quality and performance that Texas Instruments is known for. Experience faster signal propagation and improved efficiency with a nominal supply voltage of 2.5V. Trust in the unmatched value and benefits this product brings to your workflow.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and cost-effective, making it a good choice for a clock driver and buffer for long-term use.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures fast signal transmission, making this clock driver and buffer suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and compact integration into electronic circuit designs.

Nominal Supply Voltage / Vsup (V): 2.5

Operating at a standard voltage of 2.5V, this clock driver and buffer is compatible with a wide range of systems.

Load Capacitance (CL): 5 pF

Low load capacitance helps to minimize signal distortion and maintain signal integrity in the circuit.

Propagation Delay (tpd): 3 ns

Consistent propagation delay of 3 ns ensures reliable and precise signal synchronization in the system.

Temperature Grade: INDUSTRIAL

Industrial temperature grade makes this clock driver and buffer suitable for operation in harsh environments with varying temperature conditions.

Maximum Power Supply Current (ICC): 160 mA

With a maximum power supply current of 160 mA, this clock driver and buffer can support multiple outputs and provide sufficient power for operation.

Technical Specifications

Clock Drivers & Buffers CDCLVD110AVFR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Minimum fmax:

1100 MHz

Trade Compliance

CDCLVD110AVFR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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