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CDCLVD110ARHBTG4

Texas Instruments

CDCLVD110ARHBTG4 by Texas Instruments

CDCLVD110ARHBTG4 clock driver by Texas Instruments features a 3 ns propagation delay, 32 terminals, and operates at a supply voltage of 2.5V. Ideal for applications requiring differential mux input conditioning, with a package style of chip carrier and very thin profile suitable for industrial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,086 parts In-Stock

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4,086

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Digiode

USA . 748 parts In-Stock

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748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 430 parts In-Stock

1+ parts

$0.164

100+ parts

-

1k+ parts

-

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$0.158

430

$0.164

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-

$0.158

Northwest PG Solutions

USA . 1,132 parts In-Stock

1+ parts

$0.180

100+ parts

-

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$0.159

1,132

$0.180

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$0.159

Andel Nordic

Denmark . 5,866 parts In-Stock

1+ parts

$1.571

100+ parts

-

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$1.508

10k+ parts

$1.508

5,866

$1.571

-

$1.508

$1.508

AZTECH Wire

Italy . 275 parts In-Stock

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$7.486

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275

$7.486

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Parana Technologies

USA . 561 parts In-Stock

1+ parts

$24.823

100+ parts

$2,305.191

1k+ parts

$22.341

10k+ parts

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561

$24.823

$2,305.191

$22.341

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DigiPath Technology Company

USA . 1,268 parts In-Stock

1+ parts

$27.333

100+ parts

$25.147

1k+ parts

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1,268

$27.333

$25.147

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ChromeModa Solutions

Germany . 6,806 parts In-Stock

1+ parts

$27.891

100+ parts

$22.871

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6,806

$27.891

$22.871

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IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$27.891

100+ parts

$26.496

1k+ parts

$25.102

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1,185

$27.891

$26.496

$25.102

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One Stop Electronics

USA . 1,183 parts In-Stock

1+ parts

$38.000

100+ parts

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1,183

$38.000

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Microchip USA

USA . 1,760 parts In-Stock

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1,760

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Corphita

USA . 778 parts In-Stock

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Overview

Enhance your electronic designs with the CDCLVD110ARHBTG4 by Texas Instruments. Crafted with precision and expertise, this clock driver & buffer offers impeccable performance and reliability. Ideal for a wide range of applications, this product provides customers with unparalleled value and benefits. With a fast propagation delay, differential input conditioning, and 3-state output characteristics, this chip carrier promises to elevate your projects to new heights. Trust in Texas Instruments for top-quality components that deliver exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 3 ns

Fast propagation delay ensures efficient and accurate signal transmission, suitable for high-speed clock applications.

Surface Mount: YES

Ease of installation on circuit boards, saving time and effort during manufacturing processes.

Input Conditioning: DIFFERENTIAL MUX

Allows for multiple input signals to be processed efficiently, enhancing the versatility of the clock driver.

Nominal Supply Voltage / Vsup (V): 2.5

Operates at a standard supply voltage, ensuring compatibility with a wide range of systems and devices.

Load Capacitance (CL): 5 pF

Optimized load capacitance for efficient signal transmission and minimal power consumption.

Power Supplies (V): 2.5

Efficient power supply ensures stable and reliable performance of the clock driver.

No. of Terminals: 32

Sufficient number of terminals for versatile connectivity options in complex circuit designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Innovative package design allows for efficient heat dissipation and compact installation.

Output Characteristics: 3-STATE

3-state output allows for flexible signal control and management in various applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in both extreme cold and hot conditions.

Maximum Operating Temperature: 85 °C

Suitable for industrial environments with high temperature fluctuations, ensuring stable operation in demanding conditions.

Moisture Sensitivity Level (MSL): 2

Low moisture sensitivity level indicates resistance to moisture damage, ideal for use in humid environments.

Technical Specifications

Clock Drivers & Buffers CDCLVD110ARHBTG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Minimum fmax:

100 MHz

Trade Compliance

CDCLVD110ARHBTG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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