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CDCLVD110ARHBRG4

Texas Instruments

CDCLVD110ARHBRG4 by Texas Instruments

CDCLVD110ARHBRG4 clock driver by Texas Instruments features 3 ns propagation delay, 2.5V nominal voltage, and 32 terminals in a square package. Ideal for applications requiring differential mux input conditioning, with a temperature range of -40 to 85°C and peak reflow temperature of 260°C.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,937 parts In-Stock

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Digiode

USA . 3,596 parts In-Stock

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3,596

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 211 parts In-Stock

1+ parts

$0.295

100+ parts

-

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$0.283

211

$0.295

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$0.283

Northwest PG Solutions

USA . 1,626 parts In-Stock

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$0.324

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-

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$0.286

1,626

$0.324

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$0.286

Parana Technologies

USA . 1,730 parts In-Stock

1+ parts

$7.733

100+ parts

-

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$8.268

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1,730

$7.733

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$8.268

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DigiPath Technology Company

USA . 117 parts In-Stock

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$8.515

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117

$8.515

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ChromeModa Solutions

Germany . 3,423 parts In-Stock

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$8.689

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$7.125

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3,423

$8.689

$7.125

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IDEA Electronic Components Group

UK . 1,742 parts In-Stock

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$8.689

100+ parts

$8.255

1k+ parts

$7.820

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1,742

$8.689

$8.255

$7.820

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Andel Nordic

Denmark . 5,605 parts In-Stock

1+ parts

$10.666

100+ parts

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$10.239

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$10.239

5,605

$10.666

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$10.239

$10.239

AZTECH Wire

Italy . 617 parts In-Stock

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$16.522

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617

$16.522

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Corohmni

South Africa . 283 parts In-Stock

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$25.089

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283

$25.089

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Advanced Electronics

New Zealand . 83 parts In-Stock

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$33.462

100+ parts

$30.450

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$27.439

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83

$33.462

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$27.439

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One Stop Electronics

USA . 177 parts In-Stock

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$50.000

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Component Stockers USA

USA . 403 parts In-Stock

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$99.990

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Corphita

USA . 2,494 parts In-Stock

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Microchip USA

USA . 1,427 parts In-Stock

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1,427

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Overview

Enhance the performance of your electronic devices with the CDCLVD110ARHBRG4 clock driver and buffer by Texas Instruments. With a reputation for top-notch quality and reliability, Texas Instruments delivers a product that meets the highest industry standards. Ideal for applications requiring precise timing and synchronization, this clock driver ensures optimal signal integrity and efficiency. Experience the value and benefits of seamless operation and improved system performance with the CDCLVD110ARHBRG4 - the perfect solution for your electronic design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures fast and efficient operation of the clock driver, leading to accurate timing synchronization.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in various environmental conditions, making it suitable for industrial use.

Output Characteristics: 3-STATE

3-state output allows for high impedance state when not actively driving the output, providing flexibility in circuit design.

Nominal Supply Voltage / Vsup (V): 2.5

Standard supply voltage ensures compatibility with other components in the system, simplifying integration.

Technical Specifications

Clock Drivers & Buffers CDCLVD110ARHBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

110

Input Conditioning:

DIFFERENTIAL MUX

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

5 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Maximum Power Supply Current (ICC):

160 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.625 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Minimum fmax:

100 MHz

Trade Compliance

CDCLVD110ARHBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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