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CDC421100RGERG4

Texas Instruments

CDC421100RGERG4 by Texas Instruments

Texas Instruments CDC421100RGERG4 is a clock generator with 312.5 MHz output frequency, suitable for industrial applications. It operates b/w -40 to 85 °C with a supply voltage range of 3-3.6 V, drawing a max current of 110 mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,571 parts In-Stock

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4,571

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Digiode

USA . 1,295 parts In-Stock

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1,295

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Distributors (Availability)

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Native Components

USA . 177 parts In-Stock

1+ parts

$0.143

100+ parts

-

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$0.137

177

$0.143

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$0.137

Northwest PG Solutions

USA . 1,249 parts In-Stock

1+ parts

$0.157

100+ parts

-

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-

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$0.139

1,249

$0.157

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$0.139

AZTECH Wire

Italy . 349 parts In-Stock

1+ parts

$9.166

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349

$9.166

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Parana Technologies

USA . 1,005 parts In-Stock

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$17.296

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$17.510

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1,005

$17.296

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$17.510

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One Stop Electronics

USA . 1,298 parts In-Stock

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$19.000

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$19.000

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DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$19.045

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17

$19.045

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ChromeModa Solutions

Germany . 1,367 parts In-Stock

1+ parts

$19.434

100+ parts

$15.936

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1,367

$19.434

$15.936

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IDEA Electronic Components Group

UK . 468 parts In-Stock

1+ parts

$19.434

100+ parts

$18.462

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$17.491

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468

$19.434

$18.462

$17.491

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Corohmni

South Africa . 20 parts In-Stock

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$55.800

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20

$55.800

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Microchip USA

USA . 10,418 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,029 parts In-Stock

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Corphita

USA . 2,659 parts In-Stock

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Overview

Unleash the power of precision timing with the CDC421100RGERG4 clock generator by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this clock generator is designed to meet the demands of industrial applications. With a maximum output clock frequency of 312.5 MHz and a nominal primary clock/crystal frequency of 35.42 MHz, this product offers unparalleled performance and reliability. Experience seamless synchronization and optimal efficiency with the CDC421100RGERG4 - the ultimate solution for your timing needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to impact, making the clock generator suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability provides flexibility in power supply options for the clock generator.

Package Shape: SQUARE

The square package shape is compact and facilitates uniform mounting on the PCB, optimizing space utilization.

Maximum Output Clock Frequency: 312.5 MHz

With a high maximum output clock frequency, this clock generator can support demanding applications that require precise timing.

Power Supplies (V): 3.3

The 3.3V power supply is a common voltage level in many electronic systems, ensuring compatibility with a wide range of devices.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for interfacing with other components in the circuit, enabling versatile usage.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The diverse package styles offer flexibility in design and thermal management, catering to different application requirements.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power consumption and allows operation in systems with lower voltage tolerances.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in demanding environmental conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range enables the clock generator to function effectively in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finish enhances terminal conductivity and provides corrosion resistance for long-term reliability.

Terminal Position: QUAD

The quad terminal position simplifies connection and soldering processes, ensuring secure and stable electrical contacts.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim profile design, suitable for space-constrained applications.

Width: 4 mm

The compact width dimension enables efficient placement on the PCB, saving valuable board space.

Maximum Time At Peak Reflow Temperature (s): 30

The short duration for peak reflow temperature exposure prevents component damage, ensuring robust assembly reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for lead-free soldering processes, meeting modern manufacturing requirements.

Length: 4 mm

The small length dimension contributes to the overall compact form factor of the clock generator, ideal for space-limited designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures consistent performance and reliability in harsh industrial environments.

Peripheral IC Type: CLOCK GENERATOR, OTHER

The clock generator with additional peripheral IC functionality enhances system integration and functionality for diverse applications.

Technology: CMOS

The CMOS technology used in the clock generator offers low power consumption, high noise immunity, and compatibility with various systems.

Terminal Form: NO LEAD

The absence of lead-based terminals complies with environmental regulations and promotes eco-friendly manufacturing practices.

Maximum Supply Current: 110 mA

The moderate maximum supply current requirement ensures efficient power usage and compatibility with standard power sources.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V provides stable and reliable power input for consistent clock generation performance.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density PCB layouts, enabling compact and space-saving circuit designs.

Moisture Sensitivity Level (MSL): 2

The moisture sensitivity level of 2 indicates a moderate sensitivity to moisture, ensuring safe storage and handling practices.

Nominal Primary Clock/Crystal Frequency: 35.42 MHz

The nominal primary clock/crystal frequency of 35.42 MHz provides a stable reference for precise clock generation in various applications.

Technical Specifications

Clock Generators CDC421100RGERG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

312.5 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35.42 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CDC421100RGERG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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