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CDC421156RGERG4

Texas Instruments

CDC421156RGERG4 by Texas Instruments

CDC421156RGERG4 clock generator by Texas Instruments operates at a max frequency of 312.5 MHz with a supply voltage range of 3-3.6 V. It is designed for industrial applications, featuring a compact square package and quad terminal position suitable for surface mount assembly. This CMOS technology device has 24 terminals and requires a nominal voltage of 3.3 V, making it ideal for various electronic systems requiring precise clock generation capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,005 parts In-Stock

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Digiode

USA . 3,327 parts In-Stock

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3,327

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Distributors (Availability)

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Native Components

USA . 469 parts In-Stock

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$0.261

100+ parts

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$0.251

469

$0.261

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$0.251

Northwest PG Solutions

USA . 1,706 parts In-Stock

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$0.287

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-

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$0.253

1,706

$0.287

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$0.253

One Stop Electronics

USA . 904 parts In-Stock

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$2.000

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904

$2.000

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AZTECH Wire

Italy . 824 parts In-Stock

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$6.274

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$6.274

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Parana Technologies

USA . 1,700 parts In-Stock

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$59.626

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1,700

$59.626

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ChromeModa Solutions

Germany . 3,519 parts In-Stock

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$66.995

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$54.936

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$66.995

$54.936

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IDEA Electronic Components Group

UK . 634 parts In-Stock

1+ parts

$66.995

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$63.645

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$60.296

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634

$66.995

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$60.296

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Corohmni

South Africa . 2,209 parts In-Stock

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$74.232

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Microchip USA

USA . 10,757 parts In-Stock

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Corphita

USA . 2,700 parts In-Stock

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2,700

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DigiPath Technology Company

USA . 2,101 parts In-Stock

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$60.403

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$60.403

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Overview

Elevate your electronic designs with the CDC421156RGERG4 from Texas Instruments, a leading manufacturer known for superior quality and reliability. As part of the Clock Generators category, this innovative product offers precise clock timing solutions for a wide range of applications. With a maximum output frequency of 312.5 MHz and a compact square package design, this clock generator delivers exceptional value and performance. Experience the benefits of Texas Instruments' cutting-edge technology and elevate your projects to new heights with the CDC421156RGERG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability, making the product suitable for a wide range of applications.

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and enabling efficient assembly.

Maximum Supply Voltage: 3.6 V

Operating at a maximum supply voltage of 3.6 V ensures compatibility with a variety of systems and power sources.

Package Shape: SQUARE

Square package shape provides a compact design, ideal for applications where space is limited.

Maximum Output Clock Frequency: 312.5 MHz

High maximum output clock frequency of 312.5 MHz enables the clock generator to support fast data processing and communication.

Power Supplies (V): 3.3

Operating at a nominal supply voltage of 3.3 V ensures energy efficiency and compatibility with standard power sources.

No. of Terminals: 24

Having 24 terminals allows for versatile connectivity and compatibility with various systems and components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles provides efficient heat dissipation and compact design.

Minimum Supply Voltage: 3 V

Having a minimum supply voltage of 3 V ensures reliable performance across different power sources and operating conditions.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures stable performance in a wide range of environments.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures reliable performance even in harsh and extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity, corrosion resistance, and durability for long-term reliability.

Terminal Position: QUAD

Quad terminal position enables easy and secure connections, ensuring reliable operation in various applications.

Maximum Seated Height: 1 mm

Low maximum seated height of 1 mm allows for compact placement and efficient use of space.

Width: 4 mm

Narrow width of 4 mm enables space-saving design and easy integration into compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

At a maximum time of 30 seconds at peak reflow temperature, the product ensures reliable soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for secure and efficient soldering of the component onto circuit boards.

Length: 4 mm

Compact length of 4 mm provides a space-efficient design for various electronic applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments with fluctuating temperatures.

Peripheral IC Type: CLOCK GENERATOR, OTHER

Being a clock generator and other peripheral IC type, the product offers versatile functionality for diverse electronic applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: NO LEAD

No-lead terminal form simplifies assembly and ensures environmentally friendly disposal.

Maximum Supply Current: 110 mA

Operating at a maximum supply current of 110 mA, the product offers efficient power consumption for optimized performance.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V provides standard power compatibility and efficient operation in various electronic systems.

Terminal Pitch: 0.5 mm

Terminal pitch of 0.5 mm allows for precise connections and reliable signal transmission in compact designs.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 indicates the product can withstand moderate exposure to moisture during handling and assembly.

Nominal Primary Clock/Crystal Frequency: 35.42 MHz

Having a nominal primary clock/crystal frequency of 35.42 MHz ensures accurate timekeeping and clock signal generation for various applications.

Technical Specifications

Clock Generators CDC421156RGERG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

312.5 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35.42 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CDC421156RGERG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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