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CDC421125RGERG4

Texas Instruments

CDC421125RGERG4 by Texas Instruments

CDC421125RGERG4 clock generator by Texas Instruments operates at a max frequency of 312.5 MHz with a supply voltage range of 3-3.6 V. This CMOS technology chip carrier is ideal for industrial applications requiring precise timing and clock generation in compact spaces, featuring a quad terminal position and nickel palladium gold finish.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,691 parts In-Stock

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Digiode

USA . 915 parts In-Stock

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Northwest PG Solutions

USA . 1,660 parts In-Stock

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$3.498

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One Stop Electronics

USA . 1,042 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 292 parts In-Stock

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$19.584

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Corohmni

South Africa . 1,054 parts In-Stock

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$51.987

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Parana Technologies

USA . 1,031 parts In-Stock

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$56.319

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IDEA Electronic Components Group

UK . 2,303 parts In-Stock

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$63.280

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$60.116

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$56.952

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ChromeModa Solutions

Germany . 1,041 parts In-Stock

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$63.280

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$51.890

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QUARKTWIN TECHNOLOGY LTD

USA . 25,852 parts In-Stock

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Microchip USA

USA . 1,676 parts In-Stock

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Corphita

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Native Components

USA . 727 parts In-Stock

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DigiPath Technology Company

USA . 700 parts In-Stock

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Overview

Enhance your electronic designs with the CDC421125RGERG4 clock generator by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-quality products that deliver reliable performance. Clock generators are essential in various applications such as telecommunications, networking, and consumer electronics. The CDC421125RGERG4 provides precise clock signals up to 312.5 MHz, making it ideal for high-speed data processing. With a compact square package and a wide temperature range, this clock generator offers exceptional value and versatility for your projects. Upgrade your designs today with the CDC421125RGERG4 and experience the superior quality and efficiency you deserve.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration onto PCBs, saving space and making assembly more efficient.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options and ensures stable operation within the specified range.

Maximum Output Clock Frequency: 312.5 MHz

The high output clock frequency enables the product to generate precise timing signals for high-speed applications and data processing.

Maximum Operating Temperature: 85 °C

The wide operating temperature range allows the clock generator to function reliably in various environmental conditions, making it versatile for different use cases.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making the clock generator energy-efficient and reliable for signal processing.

Technical Specifications

Clock Generators CDC421125RGERG4 attributes and parameters. Explore more Clock Generators devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Clock Frequency:

312.5 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35.42 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Clock Generators

Maximum Supply Current:

110 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Peripheral IC Type:

Trade Compliance

CDC421125RGERG4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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