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CD74HCT14M96G4

Texas Instruments

CD74HCT14M96G4 by Texas Instruments

CD74HCT14M96G4 by Texas Instruments is a logic gate with 6 functions, operating at 5V. It features a propagation delay of 57ns and Schmitt Trigger technology. This CMOS device is ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.215

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Sensible Micro Corp

USA . 2,560 parts In-Stock

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-

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$0.215

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$0.200

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2,560

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$0.215

$0.200

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Digiode

USA . 2,390 parts In-Stock

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Vyrian

USA . 2,003 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Corohmni

South Africa . 439 parts In-Stock

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$8.183

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439

$8.183

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Semicontronic

India . 916 parts In-Stock

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$13.000

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$12.675

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$12.610

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916

$13.000

$12.675

$12.610

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Ampacity Inc.

Singapore . 484 parts In-Stock

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$17.000

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484

$17.000

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AZTECH Wire

Italy . 249 parts In-Stock

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$17.849

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Parana Technologies

USA . 1,599 parts In-Stock

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$23.645

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$24.277

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DigiPath Technology Company

USA . 2,290 parts In-Stock

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$26.036

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$26.036

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ChromeModa Solutions

Germany . 6,719 parts In-Stock

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$26.567

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$21.785

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IDEA Electronic Components Group

UK . 1,780 parts In-Stock

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$26.567

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$25.239

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$23.910

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1,780

$26.567

$25.239

$23.910

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One Stop Electronics

USA . 1,110 parts In-Stock

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$48.000

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Microchip USA

USA . 7,928 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 5,547 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 3,178 parts In-Stock

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Argo Parts USA

USA . 2,582 parts In-Stock

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Continental Prestige Electronics

USA . 855 parts In-Stock

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Bastille Electronics

Australia . 58 parts In-Stock

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Overview

Enhance your electronic projects with the CD74HCT14M96G4 logic gates from Texas Instruments. Renowned for their high-quality components, Texas Instruments delivers reliable and efficient solutions for a wide range of applications. The CD74HCT14M96G4 offers customers unmatched value with its fast propagation delay and low power consumption. Perfect for use in diverse projects, this product provides six functions in a compact package, making it an essential component for any electronic enthusiast. Upgrade your designs today with the superior performance of Texas Instruments' CD74HCT14M96G4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Propagation Delay At Nominal Supply: 57 ns

Low propagation delay ensures quick response times in signal processing, making this product efficient for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing production costs.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard supply voltage of 5V, ensuring compatibility with common power sources.

No. of Terminals: 14

Having 14 terminals provides flexibility in connecting to other components, allowing for versatile circuit designs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in varying environmental conditions, suitable for industrial applications.

Schmitt Trigger: YES

Incorporation of Schmitt Trigger functionality provides hysteresis and noise immunity, enhancing signal stability and accuracy.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Logic Gates CD74HCT14M96G4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

57 ns

Propagation Delay (tpd):

57 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT14M96G4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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