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CD74HCT139EE4

Texas Instruments

CD74HCT139EE4 by Texas Instruments

CD74HCT139EE4 by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 4-bit input, and inverted output polarity. It operates at a nominal voltage of 5V, has a propagation delay of 45ns, and can handle a load capacitance of 50pF. Ideal for military-grade applications requiring standard input conditioning in an inline package style.

Median Price

$1.186

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

$0.321

100+ parts

$0.302

1k+ parts

$0.273

10k+ parts

-

250

$0.321

$0.302

$0.273

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Mouser Electronics

USA . 791 parts In-Stock

1+ parts

$2.050

100+ parts

$0.794

1k+ parts

$0.393

10k+ parts

$0.363

791

$2.050

$0.794

$0.393

$0.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,463 parts In-Stock

1+ parts

$0.305

100+ parts

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2,463

$0.305

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Vyrian

USA . 6,353 parts In-Stock

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6,353

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Ashlea Components Ltd

UK . 25 parts In-Stock

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25

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Distributors (Availability)

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Corphita

USA . 2,567 parts In-Stock

1+ parts

$0.289

100+ parts

-

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2,567

$0.289

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Native Components

USA . 487 parts In-Stock

1+ parts

$1.075

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487

$1.075

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Northwest PG Solutions

USA . 2,065 parts In-Stock

1+ parts

$1.183

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2,065

$1.183

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Parana Technologies

USA . 255 parts In-Stock

1+ parts

$15.595

100+ parts

-

1k+ parts

$15.969

10k+ parts

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255

$15.595

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$15.969

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ChromeModa Solutions

Germany . 6,408 parts In-Stock

1+ parts

$17.523

100+ parts

$14.369

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6,408

$17.523

$14.369

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IDEA Electronic Components Group

UK . 1,972 parts In-Stock

1+ parts

$17.523

100+ parts

$16.647

1k+ parts

$15.771

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1,972

$17.523

$16.647

$15.771

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Microchip USA

USA . 1,947 parts In-Stock

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1,947

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$15.799

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1,539

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$15.799

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Overview

Enhance your electronic projects with the superior quality and reliability of the CD74HCT139EE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. The CD74HCT139EE4, belonging to the Decoder & Drivers category, offers unmatched precision and efficiency in decoding tasks, making it ideal for a wide range of applications. Experience the value and benefits of this product, from its high-speed operation to its advanced technology, providing customers with the competitive edge they need. Elevate your projects with Texas Instruments' CD74HCT139EE4 and witness unparalleled results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external elements, making the product suitable for various environments.

Propagation Delay At Nominal Supply: 45 ns

Low propagation delay ensures quick response time, making this decoder and driver efficient for time-sensitive applications.

No. of Functions: 2

Having multiple functions in one product reduces the need for additional components, saving space and simplifying the overall design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes this product compatible with common electronic systems.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this decoder and driver can withstand harsh environmental conditions without compromising performance.

Technical Specifications

Decoder & Drivers CD74HCT139EE4 attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HCT

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e4

Length:

19.305 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

45 ns

Propagation Delay (tpd):

51 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD74HCT139EE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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