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CD74HCT132MTE4

Texas Instruments

CD74HCT132MTE4 by Texas Instruments

CD74HCT132MTE4 by Texas Instruments is a 14-terminal logic gate with 4 functions and 2 inputs. It operates at a nominal voltage of 5V, with a propagation delay of 50ns. Suitable for military-grade applications due to its Schmitt Trigger technology and wide operating temperature range from -55°C to 125°C.

Median Price

$0.638

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 38 parts In-Stock

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$0.638

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$0.638

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Vyrian

USA . 2,199 parts In-Stock

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Digiode

USA . 109 parts In-Stock

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109

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 50 parts In-Stock

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$0.638

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50

$0.638

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AZTECH Wire

Italy . 484 parts In-Stock

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$15.212

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Parana Technologies

USA . 480 parts In-Stock

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$17.301

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$17.515

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$17.301

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DigiPath Technology Company

USA . 552 parts In-Stock

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$19.050

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$17.526

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552

$19.050

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ChromeModa Solutions

Germany . 6,840 parts In-Stock

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$19.439

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$15.940

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$19.439

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IDEA Electronic Components Group

UK . 214 parts In-Stock

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$19.439

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$18.467

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$17.495

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214

$19.439

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$17.495

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Ampacity Inc.

Singapore . 1,048 parts In-Stock

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$28.000

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$28.000

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One Stop Electronics

USA . 1,566 parts In-Stock

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$59.000

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Component Stockers USA

USA . 446 parts In-Stock

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$99.990

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 2,116 parts In-Stock

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Microchip USA

USA . 1,525 parts In-Stock

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Overview

Enhance your electronic projects with the CD74HCT132MTE4 logic gates from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that meets the highest industry standards. Whether you're working on industrial automation, consumer electronics, or telecommunications applications, this versatile component offers fast propagation delays, low power consumption, and ease of installation thanks to its surface mount design. Trust Texas Instruments to provide the solutions you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a long lifespan for the product.

Propagation Delay At Nominal Supply: 50 ns

Fast propagation delay ensures quick response time for signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on printed circuit boards, saving space and enabling automated assembly processes.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage makes it compatible with a wide range of electronic systems and power sources.

No. of Functions: 4

Four functions in one device offer versatility and flexibility in circuit design and implementation.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for reliable performance in various environmental conditions, suitable for industrial and automotive applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it energy-efficient and reliable for long-term use.

Schmitt Trigger: YES

Schmitt trigger input ensures noise immunity and signal stability, essential for accurate digital signal processing.

Technical Specifications

Logic Gates CD74HCT132MTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

HCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

50 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD74HCT132MTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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