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CD74HC574M96E4

Texas Instruments

CD74HC574M96E4 by Texas Instruments

CD74HC574M96E4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 50ns. It operates at a supply voltage range of 2-6V and has a max frequency of 20MHz. Ideal for applications requiring fast signal transmission in compact spaces, such as military-grade electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,884 parts In-Stock

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Digiode

USA . 52 parts In-Stock

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Andel Nordic

Denmark . 266 parts In-Stock

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$1.429

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$1.372

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$1.372

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$1.429

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$1.372

One Stop Electronics

USA . 258 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 587 parts In-Stock

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$19.299

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Parana Technologies

USA . 205 parts In-Stock

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$23.009

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$23.655

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DigiPath Technology Company

USA . 1,145 parts In-Stock

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$25.336

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$23.309

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ChromeModa Solutions

Germany . 4,690 parts In-Stock

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$25.853

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$21.199

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IDEA Electronic Components Group

UK . 2,022 parts In-Stock

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$25.853

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$24.560

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$23.268

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Component Stockers USA

USA . 556 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 22,914 parts In-Stock

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Perfect Parts

USA . 9,601 parts In-Stock

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Microchip USA

USA . 4,475 parts In-Stock

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Corphita

USA . 3,594 parts In-Stock

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Northwest PG Solutions

USA . 1,926 parts In-Stock

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Native Components

USA . 86 parts In-Stock

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Overview

Elevate your electronic designs with the CD74HC574M96E4 by Texas Instruments, a top-tier manufacturer known for excellence in bus driver & transceivers. This small outline package offers true value and benefits with its 3-state output characteristics, positive edge trigger type, and military-grade temperature grade. Ideal for a wide range of applications, this product boasts a maximum frequency of 20MHz and a propagation delay of just 50ns at nominal supply voltage, ensuring optimal performance. Discover the advantages of Texas Instruments quality and reliability in every aspect of your project with the CD74HC574M96E4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability of the product, making it suitable for various operating conditions.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the bus driver & transceivers, ensuring consistent performance.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, making it suitable for demanding industrial applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, making this product energy-efficient and reliable.

Trigger Type: POSITIVE EDGE

The positive edge trigger type allows precise and controlled signal triggering, enhancing the overall performance of the bus driver & transceivers.

Technical Specifications

Bus Driver & Transceivers CD74HC574M96E4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

HC/UH

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

20000000 Hz

Maximum I (ol):

7.8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

50 ns

Propagation Delay (tpd):

250 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Trade Compliance

CD74HC574M96E4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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